Wiring Board Via Arrangement via Lattice Point Offset
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Solution Overview
Problem
Existing methods for arranging vias on multilayer wiring boards, such as adjusting via pad positions or pitch intervals, are inefficient and can cause deviations in wiring density, making it difficult to increase the number of housed wirings without expanding via arrangement areas.
Innovation Solution
A wiring board design support apparatus that moves lattice points with equal intervals in both vertical and horizontal directions, alternately changing directions for each row and column to arrange vias at new positions, thereby optimizing via pad placement and improving wiring housing efficiency without area expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If via pad positions are adjusted to arbitrary positions to improve wiring housing property, then wiring housing property is improved, but work efficiency deteriorates and via arrangement area expands
Solution Approach 1:
The invention changes the parameter of via pad arrangement from arbitrary positions to systematic offset positions based on lattice point movements. By defining specific movement amounts (e.g., 0.05mm) and directions (alternating horizontal and vertical directions for adjacent rows), the system achieves improved wiring housing property while maintaining regular, predictable patterns that preserve work efficiency and prevent area expansion.
2Manufacturing precision
If pitch intervals between via pads are adjusted to increase number of housed wirings, then wiring housing property is improved, but deviation in number of housed wirings occurs and other wiring layers are affected
Solution Approach 1:
The invention applies local quality by creating controlled variations in pitch intervals only where needed for wiring housing, while maintaining uniform pitch intervals in other areas. By offsetting lattice points systematically rather than uniformly adjusting all pitch intervals, the invention improves wiring housing property in specific local regions without causing widespread deviations that would affect other wiring layers.
Solution Approach 2:
The invention changes the pitch interval parameter locally through selective offsetting of lattice points in alternating directions. This creates a pattern where some regions have increased pitch intervals to accommodate additional wirings, while other regions maintain original pitch intervals, thereby improving wiring housing property without causing inconsistent deviations across the entire wiring board.
3Manufacturing precision
If via arrangement area is expanded to accommodate more vias, then wiring housing property is improved, but mounted part arrangement density deteriorates
Solution Approach 1:
The invention utilizes another dimension by offsetting lattice points not only horizontally but also vertically in alternating directions. This two-dimensional offsetting strategy allows vias to be rearranged within the existing area boundaries, improving wiring housing property without expanding the overall via arrangement area, thereby preserving mounted part arrangement density.
Data Source
AI summary
A wiring board design support apparatus, in which a plurality of vias are arranged on a wiring board, includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.