Wiring Board Warping Control via Temporary Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring board manufacturing methods face challenges with warping due to thermal expansion coefficient differences between materials, which restrict design flexibility and increase production complexity and costs, while prior solutions complicate the process and reduce reliability.
Innovation Solution
A method involving a symmetrical double-sided wiring board structure with structural aids and a planar temporary bonding means, allowing for embedding electrical components in slots with matching thermal expansion coefficients, enabling simple fabrication and robustness without design restrictions, using materials like molding resin sheets and polymer composites.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If additional layers are added to manipulate thermal expansion characteristics, then warping is reduced, but device complexity increases
Solution Approach 1:
A temporary bonding means is introduced as an intermediary layer between the wiring board structure and the external environment during manufacturing. This temporary layer compensates for thermal expansion differences without requiring permanent structural modifications, thus reducing warping while maintaining structural simplicity.
Solution Approach 2:
The thermal expansion characteristics are managed by changing the parameters of the temporary bonding means (such as its thickness, material properties, or bonding strength) rather than modifying the fundamental wiring board structure. This allows warping control through parameter adjustment without increasing device complexity.
2Stability of the object's composition
If thermal treatment is applied to reduce warping, then stability improves, but manufacturing time increases
Solution Approach 1:
The temporary bonding means is applied in advance during the manufacturing process to prevent warping from occurring in the first place, rather than requiring subsequent thermal treatment to correct warping. This preliminary action eliminates the need for time-consuming thermal processing steps.
Solution Approach 2:
The warping control function is extracted from the thermal treatment process and transferred to the temporary bonding means. This separates the warping prevention function from time-consuming thermal processing, allowing manufacturing to proceed more efficiently.
3Productivity
If components are densely mounted to reduce size, then productivity increases, but manufacturing precision requirements increase
Solution Approach 1:
The temporary bonding means provides preliminary support and positioning for densely mounted components, preventing misalignment before it occurs. This preliminary anti-action maintains manufacturing precision even at high packaging densities by compensating for thermal and mechanical stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes warping, enhances mechanical and electrical robustness, maintains design flexibility, and simplifies the manufacturing process, while maintaining cost-effectiveness and reliability, allowing for efficient production with existing equipment modifications.
Implementation Method 1
The warping may be caused e.g. during thermal treatment of the wiring board by differences between thermal expansion coefficients of layers of different materials in the wiring board structure
Data Source
Figure 1~3
Figure 4~6
Figure 7~9
AI summary
A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid (10) on each side of a planar temporary bonding means (2), arranging a slot (3) from the at least one structural aid (10) on each side of the planar temporary bonding means (2), embedding the electrical component (4) in the slot (3), such that the terminals (6) of the electrical component (4) face away from the planar temporary bonding means (2), mounting at least one electrical component (4) on a component foil (5), such that the terminals (6) of the electrical component (4) face the component foil (5), mounting the component foil (5) at least partially on the at least one structural aid (10), on each side of the planar temporary bonding means (2).