Resin-Filled Wiring Board Through Holes for Low-Loss Waveguides
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Solution Overview
Problem
Existing methods of filling through holes in wiring boards with resin for waveguides result in non-uniform dielectric constants and increased dielectric loss due to void formation.
Innovation Solution
A wiring board configuration with an insulation substrate, electrical conductor layer on the inner wall of through holes, and an organic resin layer that includes a filling portion within the through holes, formed by heating and pressurizing an organic resin film to reduce voids and ensure uniform dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printing method is used to fill resin into the through hole, then the through hole can be filled with resin to function as a waveguide, but voids are formed in the resin causing non-uniform dielectric constant and increased dielectric loss
Solution Approach 1:
The patent changes the physical state of the resin from a paste-like printing material to a liquid resin that is injected under pressure. This parameter change allows the resin to flow smoothly into the through hole without forming voids, achieving uniform dielectric constant while maintaining waveguide function
Solution Approach 2:
The patent uses hydraulic pressure to inject liquid resin into the through hole. By applying pressure to the liquid resin, it forces the material to fill the hole completely without air pockets or voids, ensuring uniform dielectric properties throughout the waveguide structure
2Adaptability or versatility
If the through hole is filled with resin using printing method, then integration of wiring board, antenna board, and control board is achieved, but dielectric loss increases due to void formation
Solution Approach 1:
The patent employs hydraulic injection to fill the through hole with liquid resin, eliminating voids that cause dielectric loss. This method maintains the integration benefit while significantly reducing energy loss in the waveguide
Solution Approach 2:
The patent transitions from using printing paste to liquid resin with different physical parameters. The liquid state and pressure-driven injection enable complete filling without voids, reducing dielectric loss while preserving the integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces dielectric loss and ensures a uniform dielectric constant, enabling the through holes to function as effective waveguides with reduced reflection.
Implementation Method 1
performing heating and pressurizing treatment to fill the through hole with a part of the organic resin film
Implementation Method 2
performing heating and pressurizing treatment to fill the through hole with a part of the organic resin film
Implementation Method 3
curing the organic resin film to form an organic resin layer
Data Source
AI summary
A wiring board includes an insulation substrate including a through hole, an electrical conductor layer located on at least a part of an inner wall surface of the through hole and a surface of the insulation substrate, and an organic resin layer covering the insulation substrate and the electrical conductor layer. The organic resin layer includes a filling portion located in the through hole.