Multi-Layer Wiring Body with Embedded Power Lines
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Solution Overview
Problem
The challenge is to increase the current capacity of power supply lines in electronic devices while maintaining the narrow width constraints of the wiring body, as signal frequencies rise, leading to increased signal transmission loss and power consumption demands.
Innovation Solution
A wiring body design featuring a core insulating base material with signal and power supply lines on opposite surfaces, connected by interlayer connections, and embedded within dielectric layers, along with ground layers to reduce noise and electromagnetic interference, allowing for thicker power supply lines without increasing the overall width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the width of the wiring body is increased to accommodate thicker power supply lines, then the current capacity of power supply lines is improved, but the width constraint of the wiring body is violated
Solution Approach 1:
The patent transitions from a single-layer power supply line configuration to a multi-layer configuration where power supply lines are distributed across different layers (first power supply line on first main surface, second power supply line on second main surface). This dimensional change allows the wiring body to achieve equivalent or greater current capacity without increasing the planar width, as the current path is extended through the thickness dimension via interlayer connection portions.
Solution Approach 2:
The patent embeds multiple functional elements within the wiring body structure, including nesting power supply lines, signal lines, and ground layers within a compact multi-layer configuration. The interlayer connection portions nest through the core insulating base material to electrically connect corresponding conductors across layers, achieving high current capacity within a constrained width by utilizing the internal three-dimensional space efficiently.
2Speed
If the signal frequency is increased to meet high-speed communication requirements, then the signal transmission speed is improved, but the signal transmission loss increases
Solution Approach 1:
The patent introduces ground layers as intermediary elements positioned adjacent to signal lines (first ground layer adjacent to signal line on first main surface, second ground layer adjacent to signal line on second main surface). These ground layers act as shields that reduce electromagnetic interference and minimize signal transmission loss at high frequencies, enabling high-speed signal transmission while maintaining signal integrity through the multi-layer configuration.
3Power
If the power supply line thickness is increased to handle higher power consumption, then the current capacity is improved, but the wiring body width must be increased
Solution Approach 1:
The patent distributes the power supply function across multiple layers, with first and second power supply lines on opposite main surfaces connected by interlayer connection portions. This allows the effective current-carrying cross-section to be increased through the thickness dimension rather than expanding the planar width, achieving higher power supply capacity within the same width constraints.
Solution Approach 2:
The patent combines multiple power supply lines (first power supply line and second power supply line) into a unified multi-layer power distribution system. By merging these parallel power supply paths and connecting them through interlayer connection portions, the system achieves equivalent or greater total current capacity than a single thick power supply line would provide, while maintaining a compact width.
Data Source
AI summary
A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.