Wiring Member Bundle Layout for Reduced Base-Mounted Height

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Solution Overview

Problem

Existing wiring members face challenges in reducing the height dimension when the number of wire-like transmission members increases, leading to potential height suppression issues on the base member.

Innovation Solution

A wiring member design that includes a base member with wire-like transmission members divided into first and second bundles, where a cover member is fixed to the base member on both sides of each bundle and between them, allowing the bundles to be bundled together in a non-base member arrangement section, thereby reducing the overall height dimension.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of wire-like transmission members increases to accommodate more connection destinations, then the connectivity and functionality of the wiring member improves, but the height dimension of the wiring member increases

Engineering Contradiction:
ImproveconnectivityVSAvoidheight dimension
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The wire-like transmission members are divided into multiple bundles (first bundle, second bundle, third bundle) rather than keeping them as a single large bundle. This segmentation allows for better spatial arrangement and reduces the overall height dimension while maintaining the ability to connect to multiple destinations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-layer arrangement to a multi-layer arrangement where bundles are positioned at different heights. The first and second bundles are arranged in a first layer, while the third bundle is arranged in a second layer, utilizing the vertical dimension to reduce the height dimension footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If wire-like transmission members are arranged in a single layer on the base member, then the structure is simple, but the height dimension cannot be suppressed when the bundle size increases

Engineering Contradiction:
Improvestructural simplicityVSAvoidheight dimension
Core Design Contradiction:
Device complexityVSLength of stationary object

Solution Approach 1:

The patent introduces a multi-layer arrangement where the first and second bundles form a first layer and the third bundle forms a second layer. This utilizes the vertical dimension to organize bundles, effectively reducing the height dimension footprint while maintaining structural organization

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cover member is positioned to cover portions of multiple bundles simultaneously, creating a nested arrangement where the cover member encapsulates the segmented bundles in an organized manner, simplifying the overall structure

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS12142899B2Wiring member
Publication Date: 2024.11.12 SUMITOMO WIRING SYSTEMS LTD
  • US12142899B2 patent drawing
  • US12142899B2 patent drawing
  • US12142899B2 patent drawing

AI summary

In a base member arrangement section, a plurality of wire-like transmission members are divided into at least a first wire-like transmission member bundle and a second wire-like transmission member bundle, and the cover member is fixed to the base member at positions on both sides of the first wire-like transmission member bundle and the second wire-like transmission member bundle and a position between the positions on the both sides to cover the first wire-like transmission member bundle and the second wire-like transmission member bundle. In a non-base member arrangement section, the plurality of wire-like transmission members include a large bundle part where the first wire-like transmission member bundle and the second wire-like transmission member bundle are bundled together.