Wiring Circuit Board Dual Alignment Mark Layout
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Solution Overview
Problem
Wiring circuit boards require additional conductive marks exposed downwardly for specific applications, necessitating thinner and more miniaturized designs with improved visibility, while existing alignment marks face challenges in soft etching that lead to potential through holes due to positional movement during the etching process.
Innovation Solution
The implementation of a wiring circuit board with both a first and second alignment mark, where the marks are strategically positioned and shaped to satisfy specific deviation and overlap conditions, preventing through hole formation during soft etching and enabling simultaneous alignment while achieving miniaturization and thinning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a second alignment mark is added to the wiring circuit board for specific applications, then the functionality and versatility of the board is improved, but the complexity of the board structure and alignment process increases
Solution Approach 1:
The patent implements a dual alignment mark system where both the first alignment mark (visible from the front surface) and the second alignment mark (visible from the back surface) serve multiple purposes: they enable alignment operations from both sides of the board, support different mounting configurations, and provide reference points for various manufacturing processes. This multi-functional design allows the wiring circuit board to accommodate diverse application requirements without adding excessive complexity.
2Length of moving object
If the wiring circuit board is thinned to achieve miniaturization, then the size and weight of the board is reduced, but the visibility and detectability of the alignment marks deteriorate
Solution Approach 1:
The patent resolves the visibility issue in thin boards by transitioning from a single-surface alignment mark to a dual-surface system. The first alignment mark is positioned on the front surface while the second alignment mark is positioned on the back surface, both within the alignment mark layer. This dimensional distribution across opposite surfaces of the thin board ensures that alignment marks remain visible and detectable from both sides, eliminating the need for increased thickness while maintaining excellent visibility.
3Ease of manufacture
If soft etching is performed to clean the alignment marks, then the purity and cleanliness of the marks is improved, but the positional stability of the marks deteriorates due to movement toward each other
Solution Approach 1:
The patent applies preliminary anti-action by strategically designing the spatial relationship between the first and second alignment marks before the soft etching process. The marks are positioned with sufficient separation distance and appropriate orientation angles, creating a geometric configuration that prevents overlapping even when positional movement occurs during etching. This pre-designed spatial buffer compensates for the expected positional instability, ensuring that cleanliness is achieved without compromising manufacturing precision.
4Length of moving object
If the alignment marks are positioned closer together to achieve miniaturization, then the size of the board is reduced, but the risk of through hole formation during etching increases
Solution Approach 1:
The patent employs asymmetric positioning of the first and second alignment marks relative to the board's centerline and thickness direction. Rather than placing them symmetrically at equal distances, the marks are positioned with different offsets and orientations. This asymmetric arrangement, combined with specific angular relationships, creates an etching pattern where material removal does not create continuous paths between the marks, thereby preventing through hole formation even when marks are positioned closely for miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures excellent visibility and effective alignment of the marks, preventing through hole formation and allowing for the miniaturization and thinning of the circuit board, while maintaining reliable alignment capabilities.
Implementation Method 1
the first alignment mark and the second alignment mark are soft etched to ensure their visibility
Data Source
AI summary
A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.