Wiring Circuit Board Two-Dimensional Code Recognition

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Solution Overview

Problem

The visibility evaluation portion on metal-clad laminate wiring circuit boards, featuring a two-dimensional dot pattern, often experiences recognition failure due to overlaps between stripe-shaped grooves and dots, leading to interference and poor recognition.

Innovation Solution

The wiring circuit board incorporates stripe grooves and recesses that form a two-dimensional code with a dot pattern, where one side of the code aligns with the grooves, reducing overlap and improving recognition by using a laser mark with specific size and surface treatment to minimize interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If a two-dimensional dot pattern is formed on the metal layer, then visibility evaluation and management are enabled, but recognition failure occurs due to overlap with stripe grooves

Engineering Contradiction:
Improverecognition accuracy of two-dimensional codeVSAvoidinterference from stripe grooves
Core Design Contradiction:
Loss of informationVSObject-affected harmful factors

Solution Approach 1:

The patent applies asymmetry by strategically positioning the two-dimensional code so that one side is parallel to the stripe grooves while the other side is perpendicular. This asymmetric orientation minimizes the overlap between code dots and grooves, reducing interference and improving recognition accuracy compared to symmetric or random positioning.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent implements local quality by creating a localized smooth region on the metal layer surface where the two-dimensional code is formed. This smooth region is specifically treated to reduce or eliminate stripe grooves in the code area, while other areas of the metal layer may retain their normal groove structure. This localized treatment ensures high recognition accuracy for the code without affecting other functional areas.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If the visibility evaluation portion is made larger to improve readability, then recognition becomes easier, but the area occupied on the circuit board increases

Engineering Contradiction:
Improvereadability of two-dimensional codeVSAvoidarea of visibility evaluation portion
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent applies parameter changes by optimizing the size, spacing, and distribution parameters of the dots in the two-dimensional code. By carefully adjusting these parameters, the code achieves high readability and recognition accuracy within a compact area, eliminating the need for larger evaluation portions.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If conventional marking methods are used, then manufacturing is simple, but productivity is low due to time-consuming recognition processes

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidtime for recognition process
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent replaces conventional mechanical marking methods (such as stamping or printing) with laser marking technology. This substitution enables rapid, precise formation of two-dimensional codes directly on the metal layer, significantly reducing manufacturing time and improving productivity while maintaining simple implementation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies preliminary action by forming the two-dimensional code during the metal layer fabrication process itself, rather than as a separate post-processing step. The code is created on the support metal layer before final assembly, enabling early verification and reducing subsequent recognition and rework time.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces recognition failure of the two-dimensional code, enhancing productivity and readability, particularly when the recesses are sized 5 mm or less and formed as laser marks.

Implementation Method 1

the recess is a laser mark

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20240244742A1Wiring circuit board and wiring circuit board assembly sheet
Publication Date: 2024.07.18 NITTO DENKO CORP
  • US20240244742A1 patent drawing
  • US20240244742A1 patent drawing
  • US20240244742A1 patent drawing

AI summary

A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.