Wiring Circuit Board Dummy Pattern for Uniform Plating Thickness
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Solution Overview
Problem
Conventional methods for producing printed wiring boards face challenges in achieving uniform thickness of the conductive pattern near openings, as the dummy pattern is formed outside the region where the printed wiring board is formed, making it difficult to maintain uniformity.
Innovation Solution
A method involving setting pattern and opening forming regions on a supporting layer, forming an insulating layer, and using electrolytic plating to create a conductive pattern with a dummy pattern in the opening region, ensuring uniform metal ion concentration and supporting the dummy pattern with an insulating layer during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the dummy pattern is formed outside the region where the printed wiring board is formed, then the opening can be formed in the printed wiring board, but the thickness of the wiring pattern formed near the opening becomes non-uniform
Solution Approach 1:
The patent divides the substrate into distinct pattern forming regions and opening forming regions, allowing separate processing optimization for each area while maintaining overall uniformity through the dummy pattern placement strategy
Solution Approach 2:
The dummy pattern is formed in advance within the opening forming region before the actual pattern formation, pre-establishing the metal ion distribution environment to ensure uniform thickness in subsequent plating operations
2Manufacturing precision
If the dummy pattern is formed in the opening forming region, then uniform thickness of the conductive pattern can be achieved, but the dummy pattern needs support during etching
Solution Approach 1:
An insulating layer is introduced as an intermediary support structure between the dummy pattern and the substrate, providing mechanical support during etching while being electrically insulating and chemically resistant to the plating solution
Solution Approach 2:
The insulating layer is selectively formed only in the opening forming region where the dummy pattern is located, providing localized support where needed while leaving other regions unaffected
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves uniform thickness of the conductive pattern near openings by maintaining consistent metal ion concentration and supporting the dummy pattern, allowing for effective etching and removal without compromising pattern integrity.
Implementation Method 1
a third step of forming, by electrolytic plating, a conductive pattern on the insulating layer in the pattern forming region and a dummy pattern in the opening forming region
Implementation Method 2
a fourth step of etching at least a portion of the supporting layer in the opening forming region
Data Source
AI summary
A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.