Wiring Circuit Board Shield Pattern Formation
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Solution Overview
Problem
In wiring circuit boards, the limited space for shields leads to uneven thickness in wires due to simultaneous formation with shields during electrolytic plating, resulting in parts with shields being thinner or thicker than intended.
Innovation Solution
The use of separate conductive layers for wires and shield patterns, allowing them to be formed in different steps, and positioning shields only on frame portions to avoid flexibility reduction in flexible portions, with the shield patterns being electrically connected to a metal supporting layer for noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the wire and shield are simultaneously formed by electrolytic plating, then the manufacturing process is simplified, but the thickness uniformity of the wire deteriorates
Solution Approach 1:
The patent segments the formation process into two separate steps: first forming the wire by electrolytic plating, then separately forming the shield by etching a resist pattern. This segmentation eliminates the interference between wire and shield formation, ensuring uniform wire thickness while maintaining manufacturing efficiency through a systematic two-stage process.
Solution Approach 2:
The patent applies preliminary action by first forming the wire with uniform thickness before creating the shield structure. The wire is completely formed first, then the shield is added in a subsequent step using resist pattern etching. This preliminary formation of the wire ensures that its thickness is not affected by the presence of the shield during the plating process.
2Object-affected harmful factors
If the shield is disposed around the wires in the coupling body, then electromagnetic shielding is improved, but the available space for other components deteriorates
Solution Approach 1:
The patent applies local quality by providing electromagnetic shielding only where necessary - specifically around the wire portions that require protection. The shield is formed with openings that allow the wire to pass through, creating a localized shielding structure that protects against electromagnetic interference while maintaining the necessary spatial flexibility and not unnecessarily consuming space in the coupling body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents thickness differences in wires adjacent and non-adjacent to shield patterns, maintains flexibility, and effectively suppresses noise transmission.
Implementation Method 1
when the wire and the shield are simultaneously formed, for example, by electrolytic plating
Data Source
AI summary
A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.