Wiring Component Manufacturing Using Thermoplastic Embedding
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Solution Overview
Problem
Existing methods for manufacturing conductor paths in cell contact systems require complex installation and handling, especially with flexible circuit boards and cable trees, which are difficult to process due to their bending and lifting requirements, and also necessitate additional construction height and pre-attachment of guide elements.
Innovation Solution
A procedure where the electrical conductor is fixed to a carrier using a thermoplastic area softener, eliminating the need for surface guide elements and allowing for significant reduction in installation height, easier carrier preparation, and material savings by eliminating multiple wrapping of conductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If guide elements are used to fix the electrical conductor, then the conductor path can be securely formed, but the installation height in z-direction increases and the process complexity increases
Solution Approach 1:
The patent removes the guide elements (clamping or holding means) from the system entirely. Instead of using projecting guide elements to fix the conductor, the invention uses a embedding layer that receives and secures the conductor through embedding, eliminating the need for z-direction guide elements and reducing installation height.
Solution Approach 2:
The embedding layer acts as an intermediary between the carrier and the electrical conductor. This embedding layer receives the conductor and secures it through embedding, replacing the function of guide elements while allowing for lower installation height and simplified processing.
2Ease of operation
If guide elements are attached to the base body in advance, then the conductor can be guided properly, but the production process becomes more complex
Solution Approach 1:
The embedding layer is applied to the carrier in advance, but instead of attaching guide elements, the invention prepares the carrier with the embedding layer ready to receive and secure the conductor. This preliminary preparation simplifies the overall process by eliminating the need for guide element attachment steps.
Solution Approach 2:
The patent eliminates the guide elements and their attachment processes entirely. The conductor guidance and fixation are achieved through the embedding layer mechanism, which simplifies the production process by removing complex guide element installation steps.
3Reliability
If multiple wrapping of guide elements is used, then the conductor can be secured, but material consumption increases
Solution Approach 1:
The patent removes the multiple wrapping of guide elements entirely. The conductor is secured through the embedding layer mechanism, which eliminates the need for repeated wrapping operations and reduces conductor material consumption while maintaining secure fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of wiring components with minimized Z-direction installation space, simplified handling, and reduced material usage, while allowing for flexible orientation of the electrical conductor and integration into both flexible and rigid carriers.
Implementation Method 1
fixing the electrical conductor to the carrier by means of thermoplastic softening of the carrier in certain areas
Data Source
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AI summary
The present invention relates to a method for manufacturing a wiring component (10) with at least one conductor path (e.g., 11), particularly for or as a component of a cell contacting system (104), comprising the following steps: providing a single- or multi-layer carrier (15), providing an electrical conductor (12) for the conductor path (11), ejecting the electrical conductor (12) from a guide head (13), wherein the carrier (15) and/or the guide head (13) are moved translationally by machine in a predefinable path relative to each other at least in the x and y directions, preferably in the x, y, and z directions, and the electrical conductor (12) is fixed to the carrier (15) accordingly to define the conductor path (11), wherein the electrical conductor (12) is fixed to the carrier (15) by means of area-specific thermoplastic softening of the carrier (15). The invention also relates to a corresponding wiring component (10).