Wiring Electrode Patterns with Plating Layer for Toroidal Coils
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Solution Overview
Problem
Conventional electronic devices with toroidal coils embedded in wiring boards face challenges in reducing the size and profile due to high resistivity of wiring electrode patterns formed from conductive paste, leading to increased connection resistance and limited coil inductance.
Innovation Solution
The electronic device incorporates a wiring electrode pattern with an underlying conductive paste layer and a plating electrode layer, where the plating electrode layer is formed on the underlying layer, reducing resistivity through metallic bonding and improving adhesion, and uses metal pins as columnar conductors to narrow the pitch between turns, increasing coil inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wiring electrode patterns are formed using conductive paste to reduce cost and improve adhesion, then manufacturing cost decreases and adhesion strength improves, but resistivity increases
Solution Approach 1:
The patent applies composite materials by combining conductive paste (containing filler metal particles) with a plating layer formed thereon. This composite structure leverages the adhesion advantages of conductive paste while adding the low-resistivity characteristics of the plating layer, effectively resolving the contradiction between adhesion strength and resistivity.
2Reliability
If toroidal coils are mounted on the surface of the wiring board, then coil inductance can be achieved, but the profile height increases
Solution Approach 1:
The patent transitions the toroidal coil from surface mounting (2D plane) to embedded mounting within the wiring board (3D space). By utilizing the internal volume of the wiring board for coil placement, the solution maintains coil inductance while significantly reducing the profile height of the electronic device.
3Reliability
If wiring electrode patterns are formed by etching metal foil, then resistivity is low, but adhesion strength to insulating layers decreases
Solution Approach 1:
The patent creates a composite electrode structure where the plating layer (formed by electroplating on conductive paste) provides low resistivity similar to etched metal foil, while the underlying conductive paste layer maintains strong adhesion to the insulating substrate. This composite approach resolves the contradiction between resistivity and adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration lowers the resistivity of the wiring electrode pattern and connection resistance, enabling the formation of electronic devices with toroidal coils having excellent coil characteristics and higher inductance.
Implementation Method 1
a plating electrode layer formed on the underlying electrode layer
Implementation Method 2
the wiring electrode patterns 103a and 103b conduct electricity by point contact of filler metal particles therein
Data Source
AI summary
An electronic device includes an insulating layer, a plurality of upper wiring electrode patterns formed on an upper surface of the insulating layer, and a plurality of lower wiring electrode patterns formed on a lower surface of the insulating layer. The upper wiring electrode patterns and the lower wiring electrode patterns each include an underlying electrode layer formed of a conductive paste and a plating electrode layer formed on the underlying electrode layer. With this configuration, the resistivity of the upper and lower wiring electrode patterns and can be made lower than that of the upper and lower wiring electrode patterns and each including only the underlying electrode layer formed of a conductive paste.