Wiring Structure Integrating Power Harnesses with Insulation Guide

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Solution Overview

Problem

Existing wiring structures for electronic apparatuses, such as image forming devices, face challenges in securely integrating primary and secondary power harnesses, leading to potential detachment and electrical insecurity during maintenance or component replacement.

Innovation Solution

A wiring structure with distinct first and second wiring paths for primary and secondary power harnesses, integrated with an insulation guide and power supply board, ensures secure attachment to a sheet metal, preventing detachment and maintaining electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If harnesses are wired separately without integration structure, then wiring flexibility is improved, but reliability of wiring connection deteriorates due to potential detachment

Engineering Contradiction:
Improvewiring flexibilityVSAvoidwiring connection reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent combines the harness integration structure with the insulation guide by forming the integration structure directly on the insulation guide. This merging ensures that the harness is securely held in place while the insulation guide simultaneously provides electrical insulation, preventing detachment and maintaining both reliability and flexibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulation guide acts as an intermediary component between the harness and the external environment. It provides both the integration function to secure the harness and the insulation function to prevent electrical contact with conductive surfaces, thereby improving wiring connection reliability without compromising flexibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If harnesses are integrated with wiring structure, then reliability of wiring connection is improved, but device complexity increases due to additional integration components

Engineering Contradiction:
Improvewiring connection reliabilityVSAvoidwiring structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the integration function and insulation function into a single component - the insulation guide. The integration structure is formed directly on the insulation guide, eliminating the need for separate integration components and reducing overall device complexity while maintaining wiring connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulation guide is designed to perform multiple functions simultaneously: it provides electrical insulation, serves as the base for the integration structure, and directly secures the harness. This multi-functionality reduces the number of components needed and simplifies the overall wiring structure while ensuring reliable connections.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If separate wiring paths are used for primary and secondary power, then electrical insulation is improved, but manufacturing precision requirements increase due to path separation constraints

Engineering Contradiction:
Improveelectrical insulationVSAvoidwiring path positioning precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent segments the wiring structure into distinct first and second wiring paths on the insulation guide. These separate paths are specifically designed to prevent electrical contact between primary and secondary power harnesses, improving electrical insulation while the structured layout on the insulation guide helps manage positioning requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulation guide provides a three-dimensional structure with raised portions and recesses that create physical separation between wiring paths. By utilizing vertical dimensionality rather than relying solely on planar positioning, the patent achieves electrical insulation between primary and secondary power paths while reducing the stringency of manufacturing precision requirements for path separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8687381B2Wiring structure for electronic apparatus, and electronic apparatus
Publication Date: 2014.04.01 FUJIFILM BUSINESS INNOVATION CORP
  • US8687381B2 patent drawing
  • US8687381B2 patent drawing
  • US8687381B2 patent drawing

AI summary

A wiring structure for an electronic apparatus has a structure in which a first wiring path where a first harness that is used for transmitting a primary power is wired and a second wiring path where a second harness that is used for transmitting a secondary power is wired are formed, and a structure related to the first wiring path is formed so that, in a case where the first harness is wired, the first harness is integrated with the structure related to the first wiring path.