Wiring Module Heat Dissipation Vias for Image Sensors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing performance and size of integrated circuits in electronic devices have created a need for enhanced heat dissipation technologies that effectively manage the heat generated, as existing methods are inadequate in efficiently transferring heat away from sensitive components like image sensors in compact, hermetically sealed environments.
Innovation Solution
A wiring module is introduced, comprising a wiring board with heat dissipation vias that penetrate from the front surface layer to the rear surface layer, where a heat dissipation member thermally bonds with these vias to efficiently transfer heat from the image sensor to a heat dissipation sheet connected to the casing, forming a conductive path that does not interfere with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to manage heat from integrated circuits, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation vias are nested within the existing wiring board structure, penetrating through the board layers to connect the front surface layer to the rear surface layer. This integrates the heat dissipation function into the existing board without adding external structures, thereby improving heat dissipation while minimizing increases in device complexity.
Solution Approach 2:
The patent introduces heat dissipation vias that extend in the vertical dimension (from front surface layer to rear surface layer), creating a three-dimensional heat dissipation pathway. This vertical dimensionality change allows efficient heat transfer from the device package on the front surface to the heat dissipation member on the rear surface, improving heat dissipation performance without requiring lateral expansion or additional external components.
2Temperature
If heat dissipation vias are arranged below the connection region, then heat transfer efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The heat dissipation vias are strategically positioned with different arrangements in different regions: in the connection region, vias are arranged immediately below the device package connection area to maximize heat transfer from high-heat zones, while in other regions, vias are positioned to avoid interfering with signal terminals. This localized quality differentiation optimizes heat transfer efficiency while managing manufacturing precision requirements by focusing high-precision requirements only where necessary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation from image sensors and other heat-generating components within small, sealed devices, maintaining high reliability and accuracy by preventing heat buildup and thermal expansion issues, thus ensuring continuous high-performance imaging and recognition capabilities.
Implementation Method 1
These heat dissipation vias make it possible to directly transfer the heat of the device package generated on the side of the front surface layer to the heat dissipation member on the side of the rear surface layer
Implementation Method 2
a heat dissipation member that thermally bonds with the one or more heat dissipation vias
Implementation Method 3
exhibit excellent heat dissipation
Data Source
AI summary
A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.