In-Vehicle Wiring Module Layout for Short-Circuit and Water Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In vehicle wiring modules for electricity storage packs, high voltage applications pose a risk of short circuits between conductors if insulation distances are not secured, and water ingress due to dew condensation can further exacerbate this risk.
Innovation Solution
The in-vehicle wiring module features a configuration where a flexible substrate with first conductive paths and a rigid substrate with second conductive paths are electrically connected, with slits formed between the conductive paths to reduce the likelihood of short circuits, and a sealing portion using insulating resin to prevent water accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is provided between conductors to prevent short circuits, then insulation reliability is improved, but water may still enter between substrates causing short circuits
Solution Approach 1:
The patent divides the continuous conductive paths into separate segments by forming slits between adjacent conductors on the flexible substrate. This segmentation prevents water that enters between substrates from creating a continuous conductive path, thereby preventing short circuits while maintaining insulation reliability.
Solution Approach 2:
The patent introduces an insulating resin as an intermediary substance that fills the slits between conductors and seals the interface between flexible and rigid substrates. This intermediary prevents water ingress while maintaining electrical insulation, addressing both the insulation reliability and water protection requirements.
2Reliability
If insulation distances are increased to prevent short circuits under high voltage, then electrical safety is improved, but the wiring module size increases
Solution Approach 1:
By segmenting the conductive paths through slits and using insulating resin filling, the patent enables reduced insulation distances while maintaining electrical safety. The segmented structure prevents arc discharge and short circuits even at smaller spacing, allowing compact wiring module design without compromising electrical safety under high voltage conditions.
Solution Approach 2:
The insulating resin acts as a mediator that enhances dielectric strength between conductors, allowing reduced insulation distances while maintaining electrical safety. The resin fills the space between conductors and provides superior insulation properties, enabling compact design without sacrificing electrical safety.
3Object-affected harmful factors
If a sealing structure is added to prevent water ingress, then water resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the sealing function with the existing insulating resin that is already used for electrical insulation. The same insulating resin that provides electrical isolation between conductors also serves as a water sealant when it fills the slits and seals the substrate interface. This multi-functional approach improves water resistance without adding separate sealing structures or increasing manufacturing complexity.
Data Source
AI summary
An in-vehicle wiring module is configured to be attached to a plurality of electricity storage elements having electrode terminals. The in-vehicle wiring module includes busbars to be connected to the electrode terminals, flexible substrates having a first conductive path that is electrically connected to the busbars, and a rigid substrate having a second conductive path that is electrically connected to the first conductive paths. The flexible substrates overlap the rigid substrate. The flexible substrates each have a first opposing surface that is opposed to the rigid substrate. The first conductive paths each have first lands that are arranged on the first opposing surface. First slits that are open at edges of the flexible substrates are formed between the first lands of the flexible substrates. The rigid substrate has a second opposing surface that is opposed to the flexible substrates.