Wiring Sheet Mounting Structure for Low-Cost Adhesive Assembly
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Solution Overview
Problem
The existing methods for mounting electronic components on wiring boards using adhesives are labor-intensive and costly, especially when forming multiple conductor patterns on adhesive layers, which increases the overall cost and complexity.
Innovation Solution
A wiring sheet with an adhesive layer is used to indirectly mount electronic components on a wiring board, where the component is first mounted on the adhesive layer of the sheet, and the sheet is then fitted to the board, establishing conduction through the sheet between the component and the board, thereby avoiding the need for an adhesive layer on the entire board surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor patterns are formed on an adhesive layer by printing, then the electronic component can be mounted on the wiring board using adhesive, but the manufacturing cost and labor increase significantly
Solution Approach 1:
The invention divides the adhesive layer into two separate functional parts: a mounting adhesive layer on the wiring board for mechanical attachment, and a conductor pattern on a separate conductive sheet for electrical connection. This segmentation eliminates the need to form conductor patterns directly on the adhesive layer, reducing manufacturing complexity and cost while maintaining mounting reliability.
Solution Approach 2:
The invention introduces a separate conductive sheet as an intermediary between the electronic component and the wiring board. This conductive sheet carries the conductor patterns and makes electrical contact with the mounting structure, allowing the adhesive layer to focus solely on mechanical bonding without the added complexity of integrated conductor patterns.
2Reliability
If an adhesive layer is formed on the entire surface of the wiring board, then the electronic component can be securely mounted, but the manufacturing cost increases
Solution Approach 1:
The invention applies adhesive only in the local area where the electronic component needs to be mounted, rather than covering the entire wiring board surface. This localized adhesive application reduces material consumption and manufacturing cost while maintaining secure mounting through the concentrated adhesive presence at the component mounting location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the cost of the wiring board by allowing local mounting of electronic components using adhesives, enhances production efficiency, ensures waterproofing, and increases the reliability of the mounting structure by expanding the adhering area, making it tolerant to bending and reducing the risk of component detachment.
Implementation Method 1
a wiring sheet 60 having an adhesive layer 62... the electronic component 70 is directly mounted on the adhesive layer 62 of the wiring sheet 60 and the adhesive layer 62 of the wiring sheet 60 is directly fitted to the wiring board 40
Implementation Method 2
conduction between the electronic component and the wiring board is attained in stages by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board
Data Source
AI summary
In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.