Wiring Structure With Stacked Solid Electrodes

The patent merges the via wiring and build-up wiring layer into a single integrated electrode structure. The via wiring and build-up wiring layer are formed as one continuous electrode without separate connection portions, eliminating the interface where resistance typically occurs. This integration directly resolves the technical contradiction by maintaining multi-layer wiring capability while eliminating the resistance issue at connection interfaces.

The patent employs composite material structures where the electrode is formed with specific material compositions and layered configurations. By using appropriate material combinations and forming the electrode as a unified structure rather than separate components, the patent reduces electrical resistance at what would traditionally be connection interfaces between via wiring and build-up wiring layers.

The patent applies preliminary actions by preparing the electrode surfaces with specific treatments before diffusion bonding to ensure optimal bonding conditions. The electrodes are pre-formed with appropriate geometries and material compositions that facilitate subsequent diffusion bonding, making the process more controllable and reliable while managing manufacturing complexity.

The patent utilizes parameter changes in the diffusion bonding process, such as controlling temperature, pressure, and time parameters, to achieve reliable electrical connections. By optimizing these parameters, the patent ensures high-quality electrode joints while managing the complexity of the manufacturing process through precise parameter control rather than overly complex process steps.