Wiring Substrate Manufacturing Without Adhesive Layers
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates require complex and costly steps involving adhesive layers for attaching metal thin films or metal bases to temporary substrates, leading to increased costs and complexity.
Innovation Solution
A method involving a prepreg with an underlying layer, such as a metal foil or releasing agent, is used to form a build-up wiring layer on a metal foil, allowing for separation without an adhesive layer, simplifying the attachment process and reducing costs by hardening the prepreg with heating and pressurization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are used to attach metal thin films or metal bases to temporary substrates, then the metal layers can be securely attached, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the manufacturing process. Instead of using adhesive layers to attach metal thin films or metal bases to temporary substrates, the method directly forms metal layers on the temporary substrate through plating processes, removing the unnecessary adhesive component and simplifying the overall structure and process.
Solution Approach 2:
The temporary substrate is designed to serve multiple functions: it provides a support structure during manufacturing, enables plating processes to form metal layers directly, and facilitates subsequent separation of the metal wiring layer. This multi-functionality replaces the need for separate adhesive layers and other auxiliary components.
2Strength
If adhesive layers are used to attach metal thin films or metal bases to temporary substrates, then the metal layers can be securely attached, but manufacturing costs increase
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the manufacturing process. Instead of using adhesive layers to attach metal thin films or metal bases to temporary substrates, the method directly forms metal layers on the temporary substrate through plating processes, removing the unnecessary adhesive component and simplifying the overall structure and process.
Solution Approach 2:
The temporary substrate serves as a disposable support structure that is used only during the manufacturing process and then discarded. By using a cheap, single-use temporary substrate that can be easily separated after the metal wiring layer is formed, the overall manufacturing cost is reduced compared to using expensive adhesive layers and permanent substrates.
3Ease of operation
If wiring layers are formed on temporary substrates in detachable state, then wiring substrates can be obtained by separation, but the attachment and separation process becomes complicated
Solution Approach 1:
The invention segments the manufacturing process into distinct stages: forming the metal wiring layer on the temporary substrate, then separating the metal wiring layer from the temporary substrate. The temporary substrate is designed to be easily separable after serving its purpose during manufacturing, allowing clean segmentation without complex detachment mechanisms.
Solution Approach 2:
The invention extracts and eliminates the adhesive layer from the manufacturing process. Instead of using adhesive layers to attach metal thin films or metal bases to temporary substrates, the method directly forms metal layers on the temporary substrate through plating processes, removing the unnecessary adhesive component and simplifying the overall structure and process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the attachment of metal foils to temporary substrates, reduces manufacturing costs, and enables the formation of wiring substrates without a core substrate, facilitating reliable electronic component mounting with reduced warping issues.
Implementation Method 1
hardening the prepreg with heating and pressurization
Implementation Method 2
hardening the prepreg with heating and pressurization
Implementation Method 3
disposing the metal foil on a prepreg through a underlying layer interposed between them
Data Source
AI summary
A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the temporary substrate, by disposing the metal foil on a prepreg through a underlying layer interposed between them, in a way that the underlying layer is disposed in a wiring formation region on the prepreg, and the metal foil having a size larger than that of the underlying layer is caused to contact with an outer peripheral portion of the wiring formation region, and then by hardening the prepreg with heating and pressurization, forming a build-up wiring layer on the metal foil, and obtaining a wiring member in which the build-up wiring layer is formed on the metal foil, by cutting out a portion of structure in which the underlying layer, the metal foil and the build-up wiring layer are formed on the temporary substrate, the portion corresponding to a peripheral portion of the underlying layer, and thus by separating the metal foil from the temporary substrate.