Wiring Substrate Adhesive Layer Segmentation for Thermal Management
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Solution Overview
Problem
The existing adhesive layers in semiconductor packages face a trade-off between improving thermal resistance and maintaining adhesion, where enhancing thermal conductivity decreases adhesion, leading to reliability issues in heat dissipation and electrical connectivity.
Innovation Solution
A wiring substrate design incorporating a heat dissipation plate, insulation layer, and multiple adhesive layers with through wirings and pads, where the wiring layers are thermally and electrically connected to the semiconductor device, enhancing heat dissipation while maintaining adhesion through roughened surfaces and strategic adhesive layer placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesiveness of the adhesive layer to the via is improved, then the adhesion between via and adhesive layer increases, but the thermal resistance increases which adversely affects heat dissipation properties
Solution Approach 1:
The patent divides the adhesive layer into two distinct layers: a first adhesive layer between the via and the insulating layer, and a second adhesive layer between the insulating layer and the heat dissipation plate. This segmentation allows each layer to be optimized for its specific function - the first layer for adhesion and the second for heat dissipation.
Solution Approach 2:
The patent applies different material properties to different parts of the adhesive system. The first adhesive layer uses material with high adhesion properties to ensure strong bonding to the via, while the second adhesive layer uses material with high thermal conductivity to efficiently dissipate heat from the via to the heat dissipation plate.
2Temperature
If the thermal conductivity of the adhesive layer is improved, then heat dissipation properties improve, but the adhesion between via and adhesive layer decreases which lowers reliability
Solution Approach 1:
The patent divides the adhesive layer into two distinct layers: a first adhesive layer between the via and the insulating layer, and a second adhesive layer between the insulating layer and the heat dissipation plate. This segmentation allows each layer to be optimized for its specific function - the first layer for adhesion and the second for heat dissipation.
Solution Approach 2:
The patent applies different material properties to different parts of the adhesive system. The first adhesive layer uses material with high adhesion properties to ensure strong bonding to the via, while the second adhesive layer uses material with high thermal conductivity to efficiently dissipate heat from the via to the heat dissipation plate.
3Device complexity
If a single adhesive layer is used between via and heat dissipation plate, then device complexity is reduced, but both adhesion and heat dissipation cannot be simultaneously optimized
Solution Approach 1:
The patent divides the adhesive layer into two distinct layers: a first adhesive layer between the via and the insulating layer, and a second adhesive layer between the insulating layer and the heat dissipation plate. This segmentation allows each layer to be optimized for its specific function - the first layer for adhesion and the second for heat dissipation.
Solution Approach 2:
The patent applies different material properties to different parts of the adhesive system. The first adhesive layer uses material with high adhesion properties to ensure strong bonding to the via, while the second adhesive layer uses material with high thermal conductivity to efficiently dissipate heat from the via to the heat dissipation plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently transmits heat from the semiconductor device to the heat dissipation plate, dispersing it effectively and ensuring reliable adhesion and insulation, thus improving the overall performance and reliability of the semiconductor package.
Implementation Method 1
heat generated by the semiconductor device is transmitted from a via, which is formed by extending through the wiring substrate, to the heat dissipation plate through the adhesive layer
Implementation Method 2
The insulation layer is arranged on the heat dissipation plate with an adhesive layer located in between
Data Source
AI summary
A wiring substrate includes a heat sink, an insulation layer, first and second wiring layers, first and second through wirings, and first and second pads. The insulation layer is arranged on the heat sink with an adhesive layer located in between. The insulation layer includes first and second through holes. The first and second wiring layers are arranged on a surface of the insulation layer in contact with the adhesive layer. The first and second wiring layers are embedded in the adhesive layer. The first through wiring formed in the first through hole is connected to the first wiring layer and thermally coupled to the semiconductor device. The second through wiring formed in the first through hole is connected to the second wiring layer and electrically connected to the semiconductor device. The pads cover exposed surfaces of the through wirings.