Multi-piece Wiring Substrate Asymmetric Groove Burr Control
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Solution Overview
Problem
The multi-piece wiring substrate faces challenges with burr formation during division, leading to difficulties in precise mounting of electronic components and alignment issues, particularly in reduced-size imaging devices where accurate side formation is critical.
Innovation Solution
The substrate features deviated dividing grooves on both main surfaces, with inclined broken-out sections and an aligning mark at each corner, allowing for precise alignment and reduced burr protrusion, enabling precise electronic component mounting and improved alignment efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the base substrate is bent and divided along the dividing grooves, then a plurality of wiring substrates can be manufactured efficiently, but burrs are formed on the sides of the wiring substrate making precise mounting difficult
Solution Approach 1:
The dividing grooves are segmented into a first dividing groove on the first main surface and a second dividing groove on the second main surface, with their bottoms positioned at different depths. This segmentation allows the division process to create inclined broken-out sections that prevent burr formation while maintaining manufacturing efficiency.
Solution Approach 2:
The first and second dividing grooves are positioned asymmetrically with respect to each other in the thickness direction of the base substrate. The bottoms of the grooves are deviated from each other, creating an asymmetric division pattern that results in inclined broken-out sections rather than straight cuts, thereby eliminating burrs.
2Ease of operation
If alignment is performed with respect to sides having burrs, then electronic components can be mounted, but precise mounting cannot be achieved
Solution Approach 1:
The inclined broken-out sections created by the asymmetric dividing grooves convert the potential harm of burr formation into a beneficial feature. The inclination directs any potential burrs inward rather than outward, and the aligned bottoms of the grooves provide clean reference surfaces for precise alignment and mounting operations.
3Volume of moving object
If the wiring substrate is reduced in size, then the electronic device size is reduced, but precise side formation becomes more critical and difficult
Solution Approach 1:
The solution moves from a two-dimensional planar division to a three-dimensional asymmetric division by positioning the bottoms of the first and second dividing grooves at different depths in the thickness direction. This dimensional approach creates inclined broken-out sections that inherently prevent burr formation, providing precise side formation even in reduced-size substrates.
Data Source
Figure 1(a)~1(c)
Figure 2~3
Figure 4(a)~4(b)
AI summary
[Problem] Provided are a many-up wiring substrate that makes it possible to manufacture a wiring substrate where electronic components can be precisely mounted on the wiring substrate, a wiring substrate obtained therefrom, and an electronic device that can be precisely mounted on an external electric circuit board. [Solution] In a many-up wiring substrate including a base substrate (1) having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions (1a), the plurality of wiring substrate regions (1a) being arranged in a matrix, when seen in a transparent plan view, dividing grooves (2) of one main surface and dividing grooves (3) of an opposite main surface are formed to be deviated in one direction of a transverse direction or longitudinal direction, and a distance (L1) between bottoms of the dividing grooves (2) of one main surface and bottoms of the dividing grooves (3) of the opposite main surface is smaller than a distance (L2) between the bottoms of the dividing grooves (2) of the one main surface and the opposite main surface and a distance (L3) between the bottoms of the dividing grooves (3) of the opposite main surface and the one main surface. Even if a burr is formed on a side, a wiring substrate (1e) can be obtained that can reduce protrusion of the burr to the outside further than the portion that is the bottom of the dividing groove (2) of one main surface.