Wiring Substrate Chemical Blasting for Electrode Pattern Formation
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates are inefficient in creating complex or varied electrode patterns, often requiring significant time and potentially resulting in insufficient conductive filling, especially for small recessed portions.
Innovation Solution
A manufacturing method for a wiring substrate involves preparing a ceramic substrate with recessed portions and a metal member continuous through these portions, applying a protective film, blasting the exposed metal and ceramic surfaces to create a protruding metal portion, and then disposing a covering member in the blasted areas before removing the protective film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching or dry etching is performed on a ceramic substrate surface without polishing to form an etched surface, then the manufacturing process is simplified, but the surface roughness is insufficient and electrode pattern quality deteriorates
Solution Approach 1:
The patent replaces traditional mechanical polishing methods with a chemical blasting process using fluorosulfonic acid. This chemical etching method achieves superior surface roughness (Ra ≥ 350 nm) without the need for mechanical polishing steps, thereby simplifying the manufacturing process while improving surface quality for electrode pattern formation.
2Adaptability or versatility
If complex electrode patterns are formed using traditional methods, then manufacturing time increases significantly, but the patent achieves various electrode patterns easily
Solution Approach 1:
The patent applies a protective film to specific regions of the ceramic substrate before the blasting process. This preliminary masking action defines the electrode patterns in advance, allowing complex patterns to be formed easily by simply removing or modifying the protective film later, rather than performing multiple sequential etching steps.
Solution Approach 2:
The patent utilizes controlled chemical blasting with fluorosulfonic acid to create specific surface roughness parameters (Ra ≥ 350 nm) in protected regions. By adjusting the blasting conditions and protective film configuration, various electrode patterns can be achieved by changing process parameters rather than redesigning the entire manufacturing sequence.
3Reliability
If the metal member surface is not sufficiently roughened, then filling is easier, but conductivity and thermal conductivity are insufficient
Solution Approach 1:
The patent systematically controls the surface roughness parameter of the metal member to be Ra ≥ 350 nm through chemical blasting. This specific parameter range optimizes both conductivity (by increasing surface area for electrical contact) and ease of filling (by providing adequate surface texture for material adhesion without being excessive).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the easy formation of various electrode patterns and enhances conductivity by increasing the surface area of the metal member and improving thermal conductivity and heat dissipation properties.
Implementation Method 1
blasting the other part of the metal member other than the part of the metal member provided with the protective film and at least a part of the first surface of the ceramic plate
Data Source
AI summary
A method of manufacturing a wiring substrate includes preparing a ceramic substrate including a ceramic plate having a first recessed portion disposed in a first surface, a second recessed portion disposed in a second surface opposite to the first surface, and a through hole connecting the first recessed portion and the second recessed portion. A metal member is disposed continuously in the first recessed portion, the second recessed portion, and the through hole. The method includes disposing a protective film on a part of the metal member, blasting an other part of the metal member and at least a part of the first surface of the ceramic plate, disposing a covering member in a recessed portion from which the other part of the metal member and the part of the first surface of the ceramic plate have been removed by the blasting, and removing the protective film.