Wiring Substrate Post-Inserted Thin Film Capacitor Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The accuracy of mounting thin film capacitors on conventional wiring substrates is compromised due to increased complexity and size issues related to the number of chip capacitors, leading to potential misalignment and reduced connection reliability.
Innovation Solution
A wiring substrate design featuring posts inserted through reference holes in the thin film capacitor, with a surrounding frame and insulation layer to improve alignment and adhesion, allowing for precise mounting and enhanced connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of chip capacitors is increased to stabilize operation voltage, then the power supply stability is improved, but the substrate size and layout complexity increase
Solution Approach 1:
Multiple chip capacitors are integrated into a single thin film capacitor structure formed on the substrate. The thin film capacitor comprises multiple capacitor elements sharing common electrodes, combining the function of multiple discrete capacitors into one unified component that provides the same power supply stabilization effect without increasing layout complexity
Solution Approach 2:
The thin film capacitor structure serves multiple functions simultaneously: it provides power supply stabilization, acts as an alignment reference for via hole formation, and eliminates the need for separate discrete capacitor components. This multi-functionality resolves the contradiction by achieving power supply stability while simplifying the overall device structure
2Reliability
If the number of chip capacitors is increased, then the power supply stability is improved, but the substrate size increases
Solution Approach 1:
Multiple capacitor functions are merged into a single thin film capacitor structure that occupies minimal substrate area. The integrated design with shared electrodes allows the same total capacitance value to be achieved in a compact footprint compared to multiple discrete capacitors
Solution Approach 2:
The thin film capacitor structure is formed within the existing substrate architecture, nesting the capacitor elements within the substrate body rather than placing them as separate surface-mounted components. This nesting approach minimizes the overall substrate area required
3Manufacturing precision
If alignment accuracy for thin film capacitor mounting is improved, then the connection reliability is improved, but the manufacturing process complexity increases
Solution Approach 1:
Alignment reference marks are formed on the substrate before the thin film capacitor deposition process. These pre-formed references guide the subsequent capacitor formation and via hole alignment, ensuring high mounting accuracy without requiring complex real-time alignment systems during manufacturing
Solution Approach 2:
The thin film capacitor structure itself provides alignment references through its geometric features and positioning relative to substrate landmarks. The capacitor structure serves its own alignment function, eliminating the need for separate external alignment mechanisms and simplifying the manufacturing process
Data Source
AI summary
A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.