Wiring Substrate Manufacturing via Carrier Plate Extraction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of manufacturing multilayer wiring substrates requires etching to remove a metal plate, which prolongs the etching time and complicates the process, as the metal plate needs to be thin for efficient etching but thick enough to form bump recesses.
Innovation Solution
A method involving a metallic foil with a carrier plate and a peeling layer, where the carrier plate acts as a strong bearing body, allowing the formation of conductor patterns without the need for etching the metal plate, by stacking and peeling the metallic foils with insulating layers to create vias and connect conductor patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the metal plate is made thin to shorten etching time, then the etching time is reduced, but the metal plate cannot form bump recesses properly
Solution Approach 1:
The invention extracts and removes the metal plate (102b) from the stacked body after the wiring substrate (120) has been formed. The metal plate is used temporarily as a strong bearing body during manufacturing, then completely removed by etching after the wiring substrate is complete, eliminating the need to maintain it in the final product
Solution Approach 2:
The metal plate (102b) is prepared in advance with a thickness that provides sufficient strength as a bearing body during the manufacturing process. This preliminary preparation allows the metal plate to perform its supporting function before being removed, resolving the contradiction between needing thickness for strength and thinness for quick etching
2Manufacturing precision
If the peelable metallic foil is made thick to form bump recesses, then bump recesses can be formed properly, but the etching time increases
Solution Approach 1:
The metal plate (102b) is completely extracted and removed from the final wiring substrate (120) after serving its temporary purpose as a bearing body. This extraction allows the use of a thicker metal plate during manufacturing without penalty, as it is removed afterward, resolving the time penalty for using thicker material
3Ease of manufacture
If the metal plate is removed by etching, then the wiring substrate can be obtained, but the process is prolonged and complicated
Solution Approach 1:
The metal plate (102b) is removed by etching after the wiring substrate (120) is formed, using a thick metal plate that provides sufficient strength during manufacturing. The etching process is applied to the entire metal plate rather than attempting to etch through thin material, simplifying the process despite the longer etching duration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for etching, shortens the manufacturing process, and maintains the strength of the wiring substrate, preventing deformation during handling.
Implementation Method 1
a peeling layer and a metallic foil provided on one surface side of the carrier plate via the peeling layer
Implementation Method 2
the metallic foil 102a and the resin plate 100 can be adhered to each other by applying a heating and a pressure bonding
Implementation Method 3
the metallic foil 102a and the resin plate 100 can be adhered to each other by applying a heating and a pressure bonding
Implementation Method 4
the metal plate 102b is removed by the etching
Data Source
AI summary
Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate.