Wiring Substrate Layout With Non-Overlapping Cascade Connections
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Solution Overview
Problem
Existing semiconductor products face issues with circuit overlap and short circuits due to overlapping circuits in different layers, leading to transmission delays and reliability concerns, particularly in the connection of functional elements to the back plate, which are prone to foreign matter invasion and short circuits.
Innovation Solution
A wiring substrate design with non-overlapping first connection lines between drive circuit pad groups and signal lines, arranged in a manner that avoids circuitous wiring and potential short circuits, using a base substrate with control areas, drive circuit pad groups, functional element pad groups, and signal lines, with specific pad arrangements to ensure concise and reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection lines are routed to cascade drive circuit pad groups, then electrical connectivity between drive circuits is achieved, but overlapping with signal lines may cause short circuits and transmission delays
Solution Approach 1:
The patent utilizes multiple wiring layers to route connection lines and signal lines in different spatial dimensions. Connection lines are routed through specific layers (e.g., first wiring layer) while signal lines use other layers (e.g., second wiring layer), allowing both to coexist without overlapping in the vertical dimension, thus preventing short circuits while maintaining connectivity.
Solution Approach 2:
The wiring substrate is divided into multiple control areas, each containing drive circuit pad groups that are sequentially connected in cascade. This segmentation allows independent routing of connection lines within each control area, simplifying the overall wiring layout and reducing the risk of overlapping with signal lines in other areas.
2Area of stationary object
If connection lines overlap with signal lines in orthographic projection, then wiring space is optimized, but short circuits and transmission delays occur
Solution Approach 1:
The patent resolves the overlap issue by routing connection lines and signal lines through different wiring layers. Although their orthographic projections may overlap on the substrate plane, they are physically separated in the vertical dimension by insulating layers, preventing short circuits and transmission delays while optimizing the use of substrate area.
Solution Approach 2:
Insulating layers are introduced as intermediary structures between connection lines and signal lines that cross each other in different layers. These insulating layers act as mediators that prevent electrical interference and short circuits between the conductive lines, allowing their orthographic projections to overlap without compromising signal transmission reliability.
3Productivity
If drive circuit pad groups are connected in cascade sequence, then signal transmission efficiency is improved, but transmission delays increase due to overlapping circuits
Solution Approach 1:
The patent implements cascade connection of drive circuit pad groups through dedicated connection lines routed in specific wiring layers, separate from signal lines. This dimensional separation allows direct point-to-point connections between adjacent drive circuits without interference from signal lines, improving transmission efficiency while minimizing delays caused by circuit overlaps.
Data Source
AI summary
A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.