Wiring Substrate Cavity Filling to Prevent Warping
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Solution Overview
Problem
Conventional wiring substrate manufacturing methods result in warping of the core substrate due to resin hardening and contraction, leading to potential cracks in the conductive pattern and defoliation of the insulation layer.
Innovation Solution
A method involving the use of a film covering the cavity of the core substrate, with a support and insulators to symmetrically apply and harden the insulation layers, preventing warping by offsetting contraction stress and allowing for flat stacking and handling of core substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation resin is applied to one surface of the core substrate after removing the temporary tape, then the electronic component is fixed to the core substrate, but the resin hardening and contraction causes warping of the core substrate
Solution Approach 1:
The patent applies asymmetry by temporarily covering only one surface (the surface without electronic components) with an insulation resin. This asymmetric application allows the resin to fill cavities and fix components on the exposed surface while maintaining the flatness of the covered surface, thereby preventing warping of the core substrate during the fixing process.
Solution Approach 2:
The patent employs preliminary action by applying a temporary tape to one surface of the core substrate before applying the insulation resin. This temporary covering prevents the resin from causing warping on the covered surface, allowing the resin to be applied and hardened without compromising the overall flatness of the substrate. The temporary tape is removed after the resin hardens.
2Shape
If the core substrate is forcibly corrected to eliminate warping, then the flatness is improved, but cracks form in the conductive pattern and defoliation occurs
Solution Approach 1:
By asymmetrically applying the insulation resin only to the surface containing electronic components and cavities, the patent eliminates the need for forcing the substrate flat. The resin fills the cavities and fixes components while the opposite surface remains covered by temporary tape, maintaining its original flatness and preventing stress-induced cracks in the conductive pattern.
Solution Approach 2:
The temporary tape serves as a cushioning layer that prevents the insulation resin from causing warping stress on the covered surface. This beforehand cushioning protects the conductive pattern from stress-induced cracks and defoliation that would occur if the substrate were forcibly corrected after warping.
3Ease of manufacture
If a tape is temporarily applied to close the cavity, then the electronic component can be adhered, but the tape must be removed later requiring additional processing steps
Solution Approach 1:
The insulation resin serves multiple functions: it acts as an adhesive to fix the electronic component to the core substrate, fills the cavities to provide mechanical support, and serves as an insulation layer. This multi-functionality eliminates the need for separate temporary tapes and additional insulation layers, reducing the number of processing steps.
Solution Approach 2:
The patent merges the functions of the temporary tape and the insulation layer into a single insulation resin application. The resin is applied to the surface with electronic components, serving both as the fixing adhesive and as the final insulation layer, thereby combining multiple processing steps into one and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach limits warping of the core substrates, prevents cracks, and facilitates the formation of stable insulation layers, enhancing the manufacturing process by ensuring flat surfaces and reducing defects during subsequent processing steps.
Implementation Method 1
the insulating resin hardens and contracts. This may warp the core substrate
Implementation Method 2
the first insulators fix the corresponding electronic components to the corresponding core substrates
Implementation Method 3
arranging a support between the core substrates and arranging a first insulator between the support and each of the core substrates, and stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates
Data Source
AI summary
A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other.