Wiring Substrate With Variable Interlayer Conductor Thickness
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Solution Overview
Problem
Existing methods for manufacturing printed wiring boards with high-density and low-density regions of through holes face challenges in ensuring proper filling of hollow spaces, leading to potential issues like bulging or conductor peeling.
Innovation Solution
A wiring substrate design featuring an insulating layer with through holes of varying densities, where first interlayer conductors in a lower-density region have a larger thickness and inner diameter than second interlayer conductors in a higher-density region, facilitating uniform filling of hollow parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If through holes are formed at high density in a region, then the wiring capacity is improved, but the filling of hollow spaces becomes difficult leading to quality issues
Solution Approach 1:
The patent applies local quality by forming through holes at different densities in different regions of the insulating layer. The first region has a first density of through holes while the second region has a second density that is different from the first density, allowing each region to be optimized for its specific requirements while maintaining proper filling quality in both regions
2Ease of manufacture
If uniform thickness of interlayer conductors is maintained across all regions, then manufacturing simplicity is preserved, but proper filling in high-density regions becomes difficult
Solution Approach 1:
The patent implements local quality by forming interlayer conductors with different thicknesses in different regions. The interlayer conductors in the first region have a first thickness while the interlayer conductors in the second region have a second thickness that is different from the first thickness, enabling appropriate filling in both high-density and low-density regions
Data Source
AI summary
A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.