Semiconductor Wiring Substrate Layout for Crosstalk Shielding
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Solution Overview
Problem
The increasing demand for high bandwidth memory in high performance computing necessitates improved wiring flexibility and signal integrity, particularly in semiconductor packages, where crosstalk between signal traces on adjacent circuit layers poses a significant challenge.
Innovation Solution
A semiconductor wiring substrate design with alternating signal traces and ground traces on multiple circuit layers, arranged in zigzag patterns to minimize crosstalk by ensuring traces with similar voltage/current characteristics are on the same layer and shielded by ground traces, reducing interference between different byte signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If signal traces are arranged on adjacent circuit layers to increase wiring density, then wiring flexibility is improved, but crosstalk between signal traces increases
Solution Approach 1:
Ground traces are introduced as intermediary elements between adjacent signal traces on different circuit layers. These ground traces act as shields that mediate the electromagnetic interaction between signal traces, reducing crosstalk while allowing the signal traces to maintain their adjacent layer configuration for wiring flexibility.
Solution Approach 2:
The patent applies different trace types (signal vs. ground) at different locations within the circuit layer structure. Ground traces are strategically placed in specific locations between signal traces to provide localized shielding where crosstalk occurs, while signal traces maintain their functional arrangement for signal transmission.
2Productivity
If signal traces are placed closer together to increase bandwidth, then signal transmission capacity is improved, but interference between different byte signals increases
Solution Approach 1:
Ground traces serve as intermediary shielding elements positioned between signal traces carrying different byte signals. This intermediary structure reduces electromagnetic interference between adjacent signal traces, enabling higher density signal routing while maintaining signal integrity for increased bandwidth.
Solution Approach 2:
The circuit layers are segmented into alternating patterns of signal traces and ground traces. This segmentation creates distinct zones where signal traces are separated by ground trace barriers, allowing closer spacing of signal traces for higher bandwidth while preventing interference through the segmented ground trace structure.
Data Source
AI summary
A semiconductor wiring substrate comprises a first circuit layer, a second circuit layer, a plurality of first signal traces and a plurality of second signal traces. The second circuit layer is arranged in parallel with the first circuit layer. A part of the first signal traces is arranged on the first circuit layer, and another part of the first signal traces is arranged on the second circuit layer. A part of the second signal traces is arranged on the first circuit layer, and another part of the second signal traces is arranged on the second circuit layer. The part of the first signal traces and the part of the second signal traces are arranged on the first circuit layer along a first direction, another part of the first signal traces and another part of the second signal traces are arranged on the second circuit layer along the first direction.