Wiring Substrate Curved Outline Design for Ceramic Manufacturing

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Solution Overview

Problem

Existing ceramic substrate manufacturing methods face challenges in achieving stable shape and dimensional accuracy due to the complexity of cutting and grinding processes, which result in variability in circularity and increased production time, and are costly due to punch deformation or breakage.

Innovation Solution

A wiring substrate with a substrate body formed of insulating material having a plan view outline composed of multiple curved and straight portions, where the total length of curved portions is at least 40% of the sum of both, allowing for increased design freedom and easier error absorption, and a manufacturing method using punches and dies with curved surfaces to form through holes and cut straight portions efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a circular punch and die are used for blanking ceramic green sheets, then circular substrates can be produced, but manufacturing precision deteriorates when center axes deviate

Engineering Contradiction:
Improveblanking process simplicityVSAvoidcircularity accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The circular blanking process is segmented into multiple operations: first blanking a larger circular shape, then separately forming the precise circular outline through firing and cutting processes. This segmentation allows the punching operation to use a simple circular die while achieving high precision through subsequent controlled cutting steps.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention performs preliminary blanking of a circular shape before firing, then uses the fired state to perform precise cutting. The preliminary circular blanking establishes the basic shape, while the subsequent cutting refines the precision, separating the rough shaping from the precision finishing.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If punching and grinding steps are used for circular substrates, then shape can be defined, but productivity decreases due to complex multi-step process

Engineering Contradiction:
Improveshape definition accuracyVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The invention extracts the grinding step entirely from the manufacturing process. Instead of using mechanical grinding to define the circular shape, the process uses precision cutting of the fired ceramic body, which achieves the same shape definition function without the time-consuming grinding operation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces the mechanical grinding system with a cutting system that operates on the fired ceramic body. This substitution eliminates the need for abrasive grinding while achieving equivalent or superior shape precision through controlled cutting operations.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If large circular punches are used, then circular substrates can be manufactured, but device complexity and cost increase due to punch deformation and breakage

Engineering Contradiction:
Improvemanufacturing capabilityVSAvoidpunch maintenance requirements
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The shaping function is segmented between the punching operation (which creates a preliminary circular shape) and the subsequent cutting operation (which defines the final precise shape). This segmentation allows the use of simpler, smaller punching tools that are less prone to deformation and breakage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention employs cutting tools that can be easily replaced or re sharpened, rather than relying on expensive, large circular punches that are susceptible to deformation and breakage. The cutting tools serve the primary shape-defining function with lower cost and maintenance requirements.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS11658082B2Wiring substrate and method of manufacturing the same
Publication Date: 2023.05.23 NITERRA CO LTD
  • US11658082B2 patent drawing
  • US11658082B2 patent drawing
  • US11658082B2 patent drawing

AI summary

A wiring substrate includes a substrate body composed of a plurality of ceramic layers (insulating materials) and having a front surface and a back surface located on opposite sides thereof and having a side surface located between the front surface and the back surface. The outline of the substrate body in a plan view which is a view from the front surface side is composed of a plurality of curved portions separated from one another and a plurality of straight portions each located between adjacent ones of the curved portions. The total length of the curved portions in the plan view is at least 40% of the sum of the total length of the curved portions and the total length of the straight portions.