Wiring Substrate Custom Terminals Via Modification
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Solution Overview
Problem
Existing wiring substrates face challenges in accommodating custom-sized terminals for electronic circuit elements, requiring additional materials and complex configurations to prevent unintended electrical connections.
Innovation Solution
The process involves modifying existing electrically conductive vias by forming holes and filling them with insulating material to create custom terminals that overlap multiple vias without electrical contact, ensuring only one via is connected, allowing for larger terminals to be used on a standard substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If larger terminals are used to accommodate electronic circuit elements, then the terminals can properly connect to circuit element inputs/outputs, but the terminals overlap with underlying vias causing unintended electrical connections
Solution Approach 1:
The conductive material is selectively removed from specific via regions that would create unintended electrical connections with larger terminals. This extraction of conductive material from problematic via areas allows larger terminals to be used without causing short circuits or unintended connections.
Solution Approach 2:
The via structure is modified locally at specific positions where terminal overlap occurs. Instead of changing the entire via structure uniformly, the conductive material is selectively removed only from regions that would create electrical conflicts with larger terminals, while maintaining conductivity in regions that need to remain connected.
2Adaptability or versatility
If custom terminals are created by modifying existing vias, then larger terminals can be accommodated on standard substrates, but additional processing steps are required to form holes and remove conductive material
Solution Approach 1:
The conductive material removal and hole formation is performed during the via formation process itself, before the terminal is attached. By preparing the via structure in advance with selective conductive material removal, the subsequent terminal attachment becomes simpler and does not require additional complex processing steps.
Solution Approach 2:
An insulating material or air gap acts as an intermediary between the terminal and the via conductive material in regions where overlap occurs. This intermediary layer prevents direct electrical contact while allowing the terminal to be positioned over the via, enabling larger terminal sizes without direct conductive connection.
3Ease of manufacture
If standard wiring substrates are used without modification, then manufacturing is simpler, but custom terminal sizes cannot be accommodated
Solution Approach 1:
The substrate maintains its standard uniform structure for most areas, preserving ease of manufacture. However, local modifications are made to specific via regions where custom terminal accommodation is needed, selectively removing conductive material only where required to support larger terminals while leaving the rest of the substrate unchanged.
Solution Approach 2:
The standard wiring substrate design serves multiple functions: it provides the basic electrical interconnection structure for standard terminals and, through selective via modification, also accommodates custom-sized terminals. This multi-functionality allows a single substrate design to handle both standard and custom terminal requirements without requiring entirely different substrate types.
Data Source
AI summary
A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.