Wiring Substrate Insulating Layer Filling Depressed Conductor Ends
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Solution Overview
Problem
Existing wiring substrates face challenges in achieving both enhanced insulation reliability and connection reliability due to exposed end surfaces of linear conductors, which can lead to electrical floating and reduced reliability.
Innovation Solution
A wiring substrate design where the gap between adjacent linear conductors is smaller than their diameter, with specific end surface configurations – one flush and the other depressed – and an insulating layer filling the holes formed between the depressed ends, ensuring improved insulation and connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gap between adjacent linear conductors is reduced to enhance insulation, then insulation reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an intermediary insulating layer that fills the gaps between adjacent linear conductors. This insulating layer acts as a mediator that enhances insulation reliability by preventing surface conduction between conductors, while allowing larger gaps between conductors thereby reducing manufacturing precision requirements for conductor spacing.
Data Source
AI summary
A wiring substrate includes a core layer including a plate-like body and linear conductors, a first wiring layer formed on a first surface of the plate-like body, and an insulating layer formed on the first surface. A gap between the adjacent linear conductors is smaller than a diameter of each linear conductor. The linear conductors include a first linear conductor disposed in a position overlapping with the first wiring layer and conducting to the first wiring layer and a second linear conductor disposed in a position not overlapping with the first wiring layer. An end surface of the first linear conductor on the side of the first surface is approximately flush with the first surface. An end surface of the second linear conductor on the side of the first surface is in a position more depressed than the first surface to form a hole. The insulating layer is filled in the hole.