Wiring Substrate Dummy Posts for Uniform Underfill Fillet

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Solution Overview

Problem

The existing stacked wiring substrates face issues with non-uniform fillet formation around the relay board, leading to limited mounting area and reduced flexibility in part arrangement due to uneven spreading of underfill material, making it difficult to mount components accurately.

Innovation Solution

The proposed solution involves forming dummy posts along the periphery of the junction area with varying heights, where posts at the ends are higher and gradually decrease towards the center, supporting the relay board and controlling the underfill material flow to achieve a uniform fillet shape by adjusting the drainage path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If uniform height posts are used along the periphery, then the structure is simple to manufacture, but the fillet shape becomes non-uniform and mounting area is limited

Engineering Contradiction:
Improvefillet shape uniformityVSAvoidpost structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by varying the height of posts at different locations along the periphery. Specifically, posts at corner positions are set at a first height, posts at central portions of sides are set at a second height (lower than the first), and posts at other peripheral portions are set at intermediate heights. This localized variation in post height controls the underfill material drainage pattern to achieve uniform fillet formation around the relay board while maintaining manufacturing feasibility through a systematic height distribution pattern.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If underfill material is allowed to drain freely, then the joining process is simple, but the fillet spreads unevenly and part mounting flexibility is reduced

Engineering Contradiction:
Improvepart arrangement flexibilityVSAvoidjoining process complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent introduces posts as intermediary structures that mediate between the main board and relay board during the joining process. These posts, with specifically designed varying heights, act as control elements that guide the underfill material drainage. The posts prevent uncontrolled spreading of the underfill material while still allowing it to flow to form fillets, thereby achieving uniform fillet shapes that provide adequate mounting area and flexibility for placing parts near the relay board without requiring complex joining processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10959328B2Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate
Publication Date: 2021.03.23 SHINKO ELECTRIC IND CO LTD
  • US10959328B2 patent drawing
  • US10959328B2 patent drawing
  • US10959328B2 patent drawing

AI summary

A wiring substrate includes: a wiring structure that includes a wiring layer and an insulating layer laminated; a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; and a second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure. The first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side.