Wiring Substrate Electrode Pads with Multi-Material Plating
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Solution Overview
Problem
The existing methods for forming electrode pads on wiring substrates limit the flexibility and reliability of semiconductor packages due to the use of pads made from the same material, which restricts the mounting of components with different sizes and materials, leading to deteriorated electrical characteristics and reliability.
Innovation Solution
A method involving multiple electrolytic plating steps with different resist layers and support plates to form electrode pads of varying materials and structures, allowing for distinct surface treatments and connections suitable for different components, thereby enhancing the flexibility and reliability of the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrode pads are formed using the same material for all pads, then the manufacturing process is simple, but the adaptability to mount different components is poor
Solution Approach 1:
The patent applies local quality by forming electrode pads with different materials at different locations on the wiring substrate. Specifically, first electrode pads are formed with a first material while second electrode pads are formed with a second material, allowing each pad to be optimized for its specific component mounting requirements. This resolves the contradiction by maintaining manufacturing simplicity through a systematic process while achieving component-level material diversity for enhanced adaptability.
Solution Approach 2:
The patent segments the electrode pad formation process into distinct stages: forming a first plated film in first openings, then forming a second plated film in second openings. This segmentation allows different materials to be applied to different pad locations, resolving the contradiction between manufacturing simplicity and mounting flexibility by organizing the complex material diversity into manageable, sequential steps.
2Ease of manufacture
If all electrode pads are formed by the same method, then the manufacturing process is consistent and simple, but the electrical characteristics and reliability for different components are deteriorated
Solution Approach 1:
The patent implements local quality by applying different surface treatments to different electrode pads based on their specific requirements. First electrode pads receive a first surface treatment while second electrode pads receive a second surface treatment, allowing optimization of electrical characteristics and reliability for each pad type while maintaining overall process consistency through the systematic application of these localized treatments.
3Ease of manufacture
If electrode pads are formed with uniform structure, then the manufacturing is easier, but the connection strength for components with different sizes is reduced
Solution Approach 1:
The patent applies local quality by forming electrode pads with different materials and surface treatments at different locations, allowing each pad to be optimized for its specific component connection requirements. This enables enhanced connection strength for components of different sizes and materials while maintaining manufacturing ease through a systematic, location-specific approach rather than requiring completely different manufacturing processes for each pad type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved electrical characteristics and reliability by enabling the use of pads with different materials for various components, enhancing the connection strength and reducing the need for precise solder adjustment, thus accommodating components with different sizes and materials effectively.
Implementation Method 1
forming first plated films in the first openings by an electrolytic plating method
Implementation Method 2
forming second plated films in the second openings by an electrolytic plating method
Data Source
AI summary
There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films.