Wiring Substrate Narrow Electrode Pad Pitch via Layered Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing wiring substrates are limited in narrowing the pitch of electrode pads, which restricts the miniaturization and design flexibility of electronic components.
Innovation Solution
A wiring substrate is formed by laminating insulating and wiring layers, where through wirings with exposed electrode pads are created, allowing for a reduced pitch and improved connection reliability by overlapping wiring layers with the pads, and using a manufacturing process involving electrolytic plating and insulating resin layers to achieve precise patterning and exposure of wiring patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used, then the structure is simple, but the pitch of electrode pads cannot be narrowed
Solution Approach 1:
The patent transitions from planar electrode pad arrangement to a three-dimensional stacked structure where wiring layers are laminated vertically. Through-wirings penetrate multiple insulating layers to connect electrode pads at different heights, enabling pitch narrowing by utilizing the vertical dimension for interlayer connections while maintaining compact horizontal footprint.
Solution Approach 2:
The patent implements a nested multi-layer structure where insulating layers and wiring layers are alternately laminated. Each wiring layer is embedded within insulating layers, and through-wirings pass through nested layers to establish connections, creating a compact nested architecture that enables finer pitch while maintaining structural integrity.
2Reliability
If conventional manufacturing methods are used, then the process is simple, but connection reliability under heat stress is insufficient
Solution Approach 1:
The patent performs preliminary actions by forming through-wirings and electrode pads before final assembly, and by pre-laminating insulating and wiring layers in a controlled sequence. The manufacturing process prepares each layer with precise patterning and positioning beforehand, ensuring connection reliability is built into the structure during fabrication rather than relying on post-assembly adjustments.
Solution Approach 2:
The patent divides the wiring substrate into segmented functional layers: multiple insulating layers alternating with wiring layers, with through-wirings segmented to penetrate specific layers. This segmentation allows independent optimization of each layer's properties and enables precise control over connection paths, improving reliability while managing manufacturing complexity through modular layer-by-layer construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach allows for a narrower pitch of electrode pads, enhancing connection reliability and design flexibility, while maintaining robustness and reliability under heat stress, suitable for semiconductor packaging.
Implementation Method 1
a covering process for covering the first main surface of a metal plate used as a support substrate for reinforcement in manufacture with a metal thin-film layer having selective etching properties to the metal plate
Data Source
AI summary
A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.