Wiring Substrate Flatness via Segmented Insulation
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Solution Overview
Problem
Existing multilayer substrates face challenges in achieving sufficient flatness of fine pattern layers, which can lead to connection failures in circuits.
Innovation Solution
A wiring substrate is designed with a first conductor layer, a first interlayer insulating layer covering the conductor layer, a second conductor layer formed on the insulating layer, and a via conductor penetrating the insulating layer to connect the conductor layers. The interlayer insulating layer comprises a first and second insulating layer with a wiring layer formed on the first insulating layer, featuring wirings with an aspect ratio between 2.0 and 6.0, while the conductor layers have an aspect ratio between 1.0 and 2.0.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fine pattern layers are formed with high aspect ratios to reduce material usage and improve circuit density, then manufacturing complexity and connection failure risk increase
Solution Approach 1:
The interlayer insulating layer is divided into a first insulating layer and a second insulating layer. The wiring layer is formed only on the first insulating layer, while the second insulating layer is formed over it. This segmentation allows the fine pattern wiring layer to be supported by the first insulating layer, improving flatness without requiring the entire interlayer insulating layer to have high precision.
Solution Approach 2:
The wiring layer with fine patterns (aspect ratio 2.0-6.0) is formed locally only on the first insulating layer where needed, rather than uniformly across the entire substrate. This local formation of fine patterns reduces the overall manufacturing complexity while maintaining high circuit density in specific areas where it is most beneficial.
2Productivity
If wiring layers with high aspect ratios are formed across the entire substrate to maximize circuit density, then manufacturing complexity and cost increase
Solution Approach 1:
Fine pattern wirings with aspect ratios of 2.0-6.0 are formed locally only on the first insulating layer in areas where high circuit density is required, rather than uniformly across the entire substrate. This selective formation reduces manufacturing process complexity while maintaining high circuit density where needed.
Solution Approach 2:
The interlayer insulating layer is segmented into a first insulating layer (support layer) and a second insulating layer. The wiring layer is formed only on the first insulating layer, allowing fine patterns to be created in specific locations without requiring the entire substrate to undergo complex high-precision manufacturing processes.
3Productivity
If fine pattern wirings are formed with aspect ratios between 2.0 and 6.0 to improve circuit density, then the risk of connection failures increases
Solution Approach 1:
The interlayer insulating layer is segmented into a first insulating layer and a second insulating layer. The fine pattern wiring layer (aspect ratio 2.0-6.0) is formed only on the first insulating layer, which provides mechanical support and improves flatness. This segmentation allows fine patterns to achieve high circuit density while the first insulating layer maintains connection reliability by reducing deformation risk.
Solution Approach 2:
Fine pattern wirings with aspect ratios of 2.0-6.0 are formed locally on the first insulating layer where high circuit density is required, while the first insulating layer provides uniform support across the entire area. This local formation approach maintains connection reliability by ensuring that fine patterns are supported by a stable base layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the flatness and reliability of the wiring substrate, reducing the risk of connection failures and improving manufacturing yield by forming fine wirings only in necessary portions.
Implementation Method 1
forming, by laser processing, at least one opening corresponding to the wiring layer in the resist film in the pattern plating
Data Source
AI summary
A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on and covering the first conductor layer, a wiring layer formed in the interlayer insulating layer and including wirings, a second conductor layer formed on the interlayer insulating layer and including wirings, and a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first and second conductor layers. The interlayer insulating layer includes first and second insulating layers such that the wiring layer is formed on a surface of the first insulating layer, and the wiring layer is formed such that an aspect ratio of the wirings in the wiring layer is in the range of 2.0 to 6.0 and that aspect ratios of the wirings in the first and second conductor layers are in the range of 1.0 to 2.0.