Wiring Substrate Groove Filling for Thermal Warpage
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Solution Overview
Problem
Stacked wiring substrates with multiple relay substrates face damage due to warpage of the main substrate during thermal expansion and contraction, causing adjacent relay substrates to collide and become damaged during reliability evaluation tests.
Innovation Solution
A wiring substrate configuration featuring a first wiring substrate with multiple second wiring substrates arranged adjacent to each other, adhered by an adhesive layer that fills the groove portion formed by the facing side surfaces of the second wiring substrates, preventing collision and distributing stress evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple relay substrates are stacked adjacent to each other on a main substrate, then the stacked wiring substrate can be made large to mount large semiconductor chips, but the facing side surfaces of adjacent relay substrates may collide and damage the relay substrates due to warpage from thermal expansion and contraction
Solution Approach 1:
A groove portion is formed between adjacent relay substrates, and a filling material is inserted into this groove to act as an intermediary element. This filling material prevents direct contact and collision between the facing side surfaces of adjacent relay substrates, thereby protecting them from damage while allowing the substrates to be arranged adjacent to each other on the main substrate.
2Area of stationary object
If relay substrates are arranged adjacent to each other to form a large stacked wiring substrate, then large semiconductor chips can be mounted, but stress concentration occurs at the facing side surfaces during thermal expansion and contraction
Solution Approach 1:
The groove portion with filling material serves as a stress-distributing intermediary structure. Instead of stress concentrating at the direct contact points of facing side surfaces, the filling material in the groove portion distributes the stress generated during thermal expansion and contraction, reducing peak stress concentrations that would otherwise damage the relay substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive layer effectively prevents damage to the relay substrates by filling the groove portion and minimizing stress concentration, ensuring the reliability of the stacked wiring substrate during thermal expansion and contraction.
Implementation Method 1
an adhesive layer that adheres the first wiring substrate and the plurality of second wiring substrates to each other
Implementation Method 2
when a heat cycle test for evaluation of reliability of a stacked wiring substrate is performed, its main substrate may be deformed by thermal expansion and thermal contraction
Data Source
AI summary
A wiring substrate has a first wiring substrate, plurality of second wiring substrates, and an adhesive layer. The plurality of second wiring substrates are arranged adjacent to each other on the first wiring substrate. The adhesive layer adheres the first wiring substrate and the plurality of second wiring substrates to each other. The adhesive layer has a filling portion that fills a groove portion formed by opposing of side surfaces of adjacent ones of the plurality of second wiring substrates.