Wiring Substrate Heat Radiation Pattern for Thermal Management
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Solution Overview
Problem
Existing electronic devices face reliability issues due to inefficient heat dissipation in motor-driven systems, where semiconductor devices and coils generate significant heat, leading to component degradation and reduced performance.
Innovation Solution
The electronic device incorporates a wiring substrate with a heat radiation pattern that overlaps the ground pattern and housing in the thickness direction, allowing for effective heat transfer from semiconductor devices and coils to the housing without the need for additional thermal interface materials, thereby enhancing thermal conductivity and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices and coils are mounted on the wiring substrate for motor driving, then the device can perform motor control functions, but significant heat is generated leading to component degradation and reduced reliability
Solution Approach 1:
The patent introduces a ground pattern as an intermediary thermal conduction path between the semiconductor devices and the housing. The ground pattern on the wiring substrate acts as a mediator that conducts heat away from the semiconductor devices through the housing, preventing direct thermal accumulation at the component level and improving reliability while maintaining motor control functionality
Solution Approach 2:
The ground pattern serves multiple functions: it provides electrical grounding for the semiconductor devices and simultaneously acts as a thermal conduction path to dissipate heat to the housing. This multi-functionality allows the same structure to address both electrical safety and thermal management, improving reliability without adding separate cooling components
2Temperature
If additional thermal interface materials are used to improve heat dissipation, then thermal conductivity increases, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent enables the ground pattern and housing structure to serve their own dual purpose of electrical grounding and thermal conduction. The existing ground pattern on the wiring substrate automatically functions as a heat dissipation path to the housing without requiring additional thermal interface materials, allowing the system to self-manage thermal dissipation using already-present structures
Solution Approach 2:
The patent extracts the thermal conduction function from the electrical ground pattern, allowing it to independently serve as a heat dissipation path. By separating the thermal management function from the need for additional thermal interface materials, the design simplifies the overall structure while maintaining effective heat dissipation through the housing
3Reliability
If the wiring substrate structure is simplified to reduce manufacturing cost, then manufacturing precision may be compromised, but reliability can be improved through better heat dissipation
Solution Approach 1:
The patent merges the electrical grounding function and thermal conduction function into a single integrated ground pattern structure on the wiring substrate. This consolidation eliminates the need for separate thermal management components, simplifying the wiring substrate structure while maintaining both electrical safety and effective heat dissipation to the housing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability and performance of electronic devices by efficiently dissipating heat without increasing the device's size or complexity, while minimizing the risk of external noise interference in control circuits.
Implementation Method 1
a second conductor pattern is formed at a second wiring layer of the wiring layers... The second conductor pattern overlaps the first conductor pattern in the thickness direction of the wiring substrate, and overlaps a region where the housing and the wiring substrate are in contact with each other
Data Source
AI summary
The reliability of an electronic device is improved. An electronic device has a wiring substrate and a housing made of a metal for supporting the wiring substrate. A semiconductor device having a switching power transistor is mounted at the wiring substrate. A ground pattern of a conductive film and a heat radiation pattern of a conductive film are formed at the wiring substrate. The heat radiation pattern is not electrically coupled with any electronic component mounted at the wiring substrate, and is also not electrically coupled with the ground pattern. The ground pattern overlaps the semiconductor device in the thickness direction of the wiring substrate. The heat radiation pattern overlaps the ground pattern in the thickness direction of the wiring substrate, and overlaps a region where the housing and the wiring substrate are in contact with each other.