Wiring Substrate Heat Sink Thermal Conduction
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Solution Overview
Problem
The existing light emitting devices face challenges with heat dissipation due to the interposition of low heat conductivity insulating layers between wiring layers and substrates, leading to reduced efficiency in heat dissipation performance.
Innovation Solution
A wiring substrate design that includes a heat sink, a first insulating layer, a wiring pattern, and a second insulating layer with a reflective layer, where the wiring pattern is exposed and the second insulating layer contacts the side surface of the wiring pattern, enhancing heat conduction to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is interposed between the wiring layers and the substrate, then electrical insulation is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The insulating layer is divided into a first insulating layer and a second insulating layer. The first insulating layer has a higher heat conductivity than the second insulating layer, creating a segmented structure that optimizes both electrical insulation and heat dissipation. The wiring pattern is embedded in the first insulating layer while the second insulating layer is formed above it, allowing heat to conduct through the first layer to the substrate while maintaining insulation through both layers.
Solution Approach 2:
Different regions of the insulating structure have different heat conductivity properties. The first insulating layer has high heat conductivity to facilitate heat dissipation from the wiring pattern, while the second insulating layer has lower heat conductivity to maintain electrical insulation. This local differentiation of material properties resolves the contradiction between insulation and heat dissipation.
2Reliability
If the wiring pattern is completely covered by insulating layers, then electrical insulation is improved, but heat conduction path is reduced
Solution Approach 1:
The wiring pattern is partially covered by the second insulating layer rather than being completely enclosed. Specifically, the second insulating layer covers the upper surface and side surfaces of the wiring pattern, but the lower surface remains exposed or covered only by the high heat conductivity first insulating layer. This partial coverage maintains sufficient electrical insulation while preserving heat conduction paths through the first insulating layer to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation performance by increasing the contact area between the wiring patterns and the insulating layers, effectively conducting heat generated by the light emitting element to the heat sink, thereby maintaining emission efficiency and extending the lifespan of the plating solution.
Implementation Method 1
heat is conducted to the substrate made of metal via the wiring layers and the insulating layer
Implementation Method 2
a first reflective layer on the second insulating layer
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
There is provided a wiring substrate. The wiring substrate includes: a heat sink (10); a first insulating layer (20) on the heat sink; a wiring pattern (30) on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer (60) on the first insulating layer such that the wiring pattern is exposed from the second insulating layer.