Wiring Substrate Hole Segmentation for Component Isolation

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Solution Overview

Problem

Placing multiple electronic components in a single cavity of a wiring board risks displacement during the filling of an insulating layer, leading to potential short-circuits and connection failures, compromising electrical reliability.

Innovation Solution

A wiring substrate design featuring a core layer with a penetrating hole and projecting parts that divide the hole into areas, allowing multiple electronic components to be arranged at spaced intervals, supported by a resin layer that fills the hole, thereby preventing displacement and ensuring secure connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple electronic components are placed in a single cavity, then the component density is improved, but the risk of displacement and short-circuit increases

Engineering Contradiction:

Improvecomponent densityVSAvoidelectrical reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The cavity is divided into multiple regions by projecting parts that extend from the inner wall of the cavity. These projecting parts create physical separations between different electronic components, preventing them from contacting each other while still being housed in the same cavity. This segmentation approach allows multiple components to coexist without compromising electrical reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The projecting parts act as intermediary structures between adjacent electronic components. By introducing these intermediate elements, the patent prevents direct contact between components that would otherwise be in close proximity, thereby eliminating the short-circuit risk while maintaining high component density.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If electronic components are arranged closely in a cavity, then the space utilization is improved, but the risk of physical contact and short-circuit increases

Engineering Contradiction:

Improvespace utilizationVSAvoidphysical contact risk

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The cavity interior is segmented into distinct zones by projecting parts that extend inward from the cavity walls. These segments create natural spacing between electronic components, allowing efficient space utilization while preventing harmful physical contact between adjacent components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The projecting parts are strategically positioned at specific locations within the cavity to create local separations where needed. This local quality approach ensures that components are spaced appropriately in critical areas while maintaining close arrangement elsewhere, optimizing both space utilization and electrical isolation.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS9560768B2Wiring substrate and method of making wiring substrate

Publication Date: 2017.01.31 SHINKO ELECTRIC IND CO LTD

AI summary

A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole, a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween, and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part.