Wiring Substrate Insulation Layer Step Structure Delamination
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Solution Overview
Problem
Coreless wiring substrates face delamination issues due to the lack of adequate support for wiring patterns, which are formed on the same plane as the outermost insulation layer, leading to reliability concerns and increased risk of migration between adjacent patterns.
Innovation Solution
A wiring substrate design where the insulation layer covers the lower and side surfaces of the wiring patterns, with a covering portion that continuously covers the upper surface, creating a step between the insulation layer and the wiring pattern surface, thereby enhancing support and reducing delamination and migration risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the wiring pattern is formed on the same plane as the outermost insulation layer to reduce substrate thickness, then the substrate thickness is reduced, but the wiring pattern easily delaminates from the insulation layer
Solution Approach 1:
The patent transitions from a two-dimensional planar configuration where the wiring pattern and insulation layer are flush, to a three-dimensional stepped configuration where the insulation layer extends beyond the wiring pattern edges. This dimensional change provides additional bonding area and mechanical interlocking, preventing delamination while maintaining thin substrate profile.
Solution Approach 2:
The insulation layer is formed to extend beyond the wiring pattern edges before final substrate assembly. This preliminary extension creates an overlapping region that provides enhanced adhesion and prevents delamination from occurring during subsequent manufacturing or usage processes.
2Ease of manufacture
If the wiring pattern is formed on the same plane as the outermost insulation layer, then manufacturing is simplified, but migration between adjacent wiring patterns increases
Solution Approach 1:
By extending the insulation layer vertically beyond the wiring pattern plane, the patent creates an insulating barrier that physically separates adjacent wiring patterns. This three-dimensional insulation structure prevents migration pathways between patterns while maintaining manufacturing simplicity through a single-layer insulation formation process.
3Device complexity
If the insulation layer covers only the lower surface of the wiring pattern, then the structure is simpler, but the wiring pattern lacks adequate support
Solution Approach 1:
The insulation layer is extended from merely covering the lower surface to also covering the side surfaces and extending beyond the upper surface edges of the wiring pattern. This three-dimensional configuration provides comprehensive mechanical support and prevents delamination without requiring complex multi-layer insulation structures.
Data Source
AI summary
A wiring substrate is provided with a wiring pattern including a pad and a circuit pattern. The pad is formed in a mounting region where an electronic component is mounted, and the circuit pattern extends in a planar direction from the pad. An insulation layer covers a lower surface of the wiring pattern and a side surface of the wiring pattern and partially exposes an upper surface of the wiring pattern. The insulation layer includes a covering portion that continuously covers an entire peripheral portion of the upper surface of the wiring pattern. The insulation layer includes an upper surface located upward from the upper surface of the wiring pattern.