Through-Hole Wiring Substrate for Low-Resistance Interlayer Connections
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Solution Overview
Problem
Conventional wiring substrates face issues with excessive electrical resistance and heat generation due to the volume occupancy rates of interlayer connection conductors and resin bodies, leading to undesired characteristics such as voltage drop and potential disconnection, especially when the interlayer connection conductors are long and the insulating layer thickness is significant.
Innovation Solution
A wiring substrate design featuring interlayer connection conductors with a volume occupancy rate of 45% to 70% and resin bodies with a volume occupancy rate of 30% to 55% in through holes, with interlayer connection conductors having lengths of 1000 μm to 2000 μm, optimized to balance conductor thickness and electrical resistance, using metal films and resin materials to ensure reliable fine pitch patterns and current ratings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the volume occupancy rate of interlayer connection conductors is increased to reduce electrical resistance, then electrical resistance decreases, but the volume occupancy rate of resin body decreases leading to insufficient filling and potential reliability issues
Solution Approach 1:
The patent applies parameter changes by precisely controlling the volume occupancy rates of both interlayer connection conductors (45-70%) and resin bodies (30-55%) within the through holes. This quantitative parameter optimization resolves the contradiction by establishing a balanced distribution that simultaneously achieves low electrical resistance through adequate conductor presence and sufficient resin filling for structural integrity and reliability.
2Reliability
If the length of interlayer connection conductors is increased to connect conductor layers across thick insulating layers, then connection reliability improves, but electrical resistance and heat generation increase
Solution Approach 1:
The patent resolves this contradiction through parameter changes by optimizing the volume occupancy rate of interlayer connection conductors to 45-70% in through holes with lengths of 1000-2000 μm. This quantitative optimization ensures adequate conductor thickness to maintain low electrical resistance and reduce heat generation, while still achieving reliable connections across thick insulating layers through the extended conductor length.
Solution Approach 2:
The patent applies composite materials by combining interlayer connection conductors with resin bodies in a controlled volume ratio within the through holes. This composite structure allows the conductor portion to provide low-resistance electrical connection while the resin portion provides insulation and structural support, resolving the contradiction between connection reliability and energy loss in long through holes.
Data Source
AI summary
A wiring substrate includes an insulating layer having a through hole, a first conductor layer formed on a first surface of the insulating layer, a second conductor layer formed on a second surface of the insulating layer, an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers, and a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole. The interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 μm to 2000 μm in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.