Multi-piece Wiring Substrate Laser Dividing Precision
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Solution Overview
Problem
Existing multi-piece wiring substrates face challenges in achieving precise positional accuracy and minimizing conduction resistance during the formation of dividing grooves, which can lead to disconnection and increased resistance, especially when using laser beams to divide the matrix substrate into interconnection substrates.
Innovation Solution
The multi-piece wiring substrate incorporates through-holes with inner surface conductors that gradually decrease in thickness and feature inclination portions, which act as a laser beam shield and chamfered areas to prevent disconnection and improve the dividing process, ensuring accurate cutting and reduced conduction resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to form dividing grooves in the matrix substrate, then the dividing process can be automated and productivity improved, but the positional accuracy and conduction resistance may deteriorate due to potential disconnection and resistance increase
Solution Approach 1:
The inner surface conductor is formed in advance within the through-hole before the dividing groove formation. This preliminary action ensures that when the laser beam forms the dividing groove, the conductor is already in position to provide electrical connection, preventing disconnection and reducing conduction resistance while maintaining the automated laser dividing process
Solution Approach 2:
The inner surface conductor acts as an intermediary element between adjacent interconnection substrate regions. It provides a reliable electrical connection path that mediates the potential disconnection issue caused by laser beam dividing, ensuring continuous conductivity while allowing the automated dividing process to proceed
2Ease of manufacture
If the inner surface conductor thickness is uniform throughout, then the manufacturing process is simpler, but the laser beam shielding effect is reduced leading to poorer dividing precision
Solution Approach 1:
The inner surface conductor is designed with non-uniform thickness distribution, having a thicker portion at specific locations and thinner portions at others. This local quality variation creates an optimized laser beam shielding effect at critical areas, improving dividing groove positional accuracy while maintaining manufacturability through controlled deposition processes
3Reliability
If the inner surface conductor is made thicker to reduce conduction resistance, then electrical connection reliability improves, but the laser beam shielding effect increases causing poorer dividing precision
Solution Approach 1:
The inner surface conductor features localized thick portions at specific locations where strong electrical connection is critical, while maintaining thinner sections in other areas. This local quality differentiation achieves both high electrical connection reliability through thicker conductive paths and good dividing precision by limiting excessive laser beam shielding to only necessary areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the precision and effectiveness of dividing the matrix substrate into interconnection substrates, reducing the likelihood of disconnection and increasing the reliability of electrical connections, while also facilitating the attachment of metallic layers through electroplating.
Implementation Method 1
the inner surface conductor includes inclination portions that gradually increase in thickness from a boundary between a corresponding one of the dividing grooves and the inner surface conductor to an inner surface of the inner surface conductor, in vertical sectional view
Implementation Method 2
facilitating the attachment of metallic layers through electroplating
Data Source
AI summary
A multi-piece wiring substrate includes a matrix substrate including first and second insulating layers, and interconnection substrate regions arranged in a matrix. The matrix substrate includes dividing grooves opposing each other and disposed along boundaries between the interconnection substrate regions, and through-holes penetrating the matrix substrate in a thickness direction at positions where the dividing grooves are disposed. The inner surface conductor gradually decreases in thickness from a thick portion in a middle of the inner surface conductor, to thin portions disposed on a side of a boundary between the first and second insulating layers and on a first main surface side, and includes inclination portions each of which gradually increases in thickness from a boundary between corresponding one of the dividing grooves and the inner surface conductor to an inner surface of the inner surface conductor, in vertical sectional view.