Wiring Substrate Lead Layout for Short-Circuit Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display technologies face challenges in efficiently connecting electrodes and leads on wiring substrates, leading to increased risks of short circuits and open circuits, which affect production yield and reliability.
Innovation Solution
A wiring substrate design with a specific arrangement of electrodes and leads, including first and second leads, where second leads are positioned between adjacent first leads connected to different electrodes, reducing the risk of short circuits and open circuits through strategic etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electrodes and leads are arranged closely to improve space utilization, then area efficiency is improved, but the risk of short circuits increases
Solution Approach 1:
The patent introduces a lead isolation structure as an intermediary element positioned between adjacent leads. This isolation structure physically separates the leads, preventing direct contact and potential short circuits while allowing the leads to maintain close proximity for efficient space utilization. The isolation structure acts as a mediator that enables both compact arrangement and electrical isolation.
2Manufacturing precision
If complex etching processes are used to precisely position leads, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent incorporates the lead isolation structure during the initial lead formation process rather than adding it as a separate subsequent step. The isolation structure is formed concurrently with the leads through a single etching process, eliminating the need for additional complex etching steps. This preliminary action approach achieves precise positioning while simplifying the overall manufacturing process.
3Reliability
If more isolation structures are added between leads, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the lead isolation structure with the lead formation process itself, merging two functions (lead creation and isolation) into a single integrated structure. The isolation structure is formed as an inherent part of the lead pattern through one etching process, rather than being a separate added component. This merging approach provides reliable isolation without increasing structural complexity.
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
A wiring substrate, comprising a base, a plurality of electrodes, and a plurality of leads. The base has a first surface and a second surface arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, wherein at least one of the plurality of side surfaces is a selected side surface. The plurality of electrodes are arranged on the first surface of the base at intervals in a first direction, and/or are arranged on the second surface of the base at intervals in the first direction. The plurality of leads are arranged at intervals in the first direction. The plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one electrode is connected to at least two first leads, and the plurality of second leads are insulated from the electrodes. Moreover, on the first surface or the second surface of the base, at least one second lead is arranged between two first leads which are connected to different electrodes and are adjacent to each other.