Wiring Substrate Mesh Pattern Curved Pads
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Solution Overview
Problem
Existing wiring substrates face challenges in forming conductor pads with precise shapes and sizes due to the limitations of circular openings, which can lead to instability in plating resist formation and adhesion issues, affecting the accuracy and reliability of conductor patterns.
Innovation Solution
A wiring substrate with a mesh-like conductor pattern featuring polygonal openings and conductor pads with curved outer edges, allowing for stable formation and improved adhesion, as well as effective shielding, by using pattern plating methods to ensure precise conductor pad and frame formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circular openings are used for conductor pads, then the formation process is simple, but the plating resist formation becomes unstable and adhesion issues occur
Solution Approach 1:
The patent applies curvature to the conductor pad edges (curved outer edges) within the polygonal openings. This curvature design improves adhesion between the plating resist and the conductor pad surface, resolving the adhesion issues that occur with simple circular openings while maintaining manufacturing simplicity.
2Ease of manufacture
If circular openings are used for conductor pads, then the process is straightforward, but the accuracy and reliability of conductor patterns deteriorate
Solution Approach 1:
The patent employs asymmetric design by combining polygonal openings (with straight edges and corners) with curved conductor pad edges. This asymmetric configuration within the opening structure enables precise control over conductor pad shape and size, improving manufacturing precision while keeping the overall process straightforward.
3Device complexity
If conventional conductor patterns are used, then the structure is simple, but shielding effectiveness is insufficient
Solution Approach 1:
The patent segments the conductor pattern into a mesh-like structure with multiple polygonal openings and conductor pads distributed throughout. This segmentation creates multiple shielding zones that work together to improve overall shielding effectiveness while maintaining relatively simple pattern structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the stable formation of conductor pads and frames with predetermined shapes and sizes, enhancing the accuracy and reliability of the conductor patterns while providing effective shielding and improved adhesion, reducing the likelihood of defects and short circuits.
Implementation Method 1
The conductor layer is formed such that each of the openings has a polygonal shape, that gaps are formed between the conductor pads and the conductor pattern surrounding the conductor pads, and that each of the conductor pads has a curved outer edge
Data Source
AI summary
A wiring substrate includes an insulating layer, and a conductor layer formed on the insulating layer and including a mesh-like conductor pattern and conductor pads such that the mesh-like conductor pattern has openings exposing the insulating layer and that the conductor pads are formed at substantially centers of selected ones or all of the openings respectively. The conductor layer is formed such that each of the openings has a polygonal shape, that gaps are formed between the conductor pads and the conductor pattern surrounding the conductor pads, and that each of the conductor pads has a curved outer edge.