Wiring Substrate With 3D Metal Films For Heat Dissipation
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Solution Overview
Problem
Existing wiring substrates face challenges in efficiently managing Joule heat and stress concentration due to differences in thermal expansion and electrical resistance, which can lead to reliability issues in electronic devices and modules.
Innovation Solution
A wiring substrate design featuring first and second metal films with thickness gradients extending from opposing surfaces, forming a continuous and uniform structure on the side surface, composed of adhesive, barrier, and conductor layers, to uniformly diffuse Joule heat and reduce stress concentration, while maintaining low electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal films are disposed on the substrate to conduct current, then electrical resistance is reduced, but Joule heat is generated and concentrated causing reliability issues
Solution Approach 1:
The patent extends metal films from traditional planar surfaces onto the side surface of the substrate, transitioning from two-dimensional to three-dimensional current conduction paths. This spatial extension distributes Joule heat generation across multiple surfaces and volumes, reducing heat concentration at any single location while maintaining electrical connectivity
Solution Approach 2:
The patent divides the metal film into multiple segments: a first metal film extending from the first surface to the side surface, and a second metal film extending from the second surface to the side surface. This segmentation distributes the current conduction function across multiple discrete structures, thereby distributing Joule heat generation and preventing localized overheating
2Reliability
If metal films with different thermal expansion properties are applied to the substrate, then electrical conductivity is improved, but stress concentration occurs due to thermal expansion differences
Solution Approach 1:
By extending metal films onto the side surface of the substrate, the patent distributes stress accumulation zones from confined planar regions to extended three-dimensional structures. This dimensional extension allows stress to distribute across larger volumes and multiple surfaces, reducing peak stress concentrations at any single location
Solution Approach 2:
The patent segments the metal film structure into first and second metal films positioned on opposite surfaces and extending to the side surface. This segmentation creates multiple stress distribution pathways and prevents stress concentration in any single region, as each metal film segment independently manages local thermal expansion stresses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reduces electrical resistance loss, and improves the reliability of electronic devices and modules by uniformly distributing Joule heat and stress, thereby maintaining low electrical resistance and stability across the substrate.
Implementation Method 1
a first metal film disposed so as to extend from the first surface to the side surface; and a second metal film disposed so as to extend from the second surface to over the first metal film disposed on the side surface
Implementation Method 2
Existing wiring substrates face challenges in efficiently managing Joule heat
Implementation Method 3
uniformly diffuse Joule heat
Implementation Method 4
differences in thermal expansion and electrical resistance, which can lead to reliability issues
Data Source
AI summary
A wiring substrate includes a substrate, a first metal and a second metal. The substrate has a first surface, a second surface opposite the first surface, and a side surface connected to the first surface and the second surface. The first metal film is disposed so as to extend from the first surface to the side surface. The second metal film is disposed so as to extend from the second surface to the first metal film disposed on the side surface.