Recessed Wiring Substrate Frame Layout for Noise Isolation
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Solution Overview
Problem
Existing wiring substrates face challenges in providing stable operation and noise reduction for electronic components, particularly due to the lack of effective reinforcement and noise isolation in their structural design.
Innovation Solution
A wiring substrate with an insulation substrate featuring a recess section, a frame portion with a plate-shaped conductive portion, and a wiring conductor that connects the electronic component to external connection conductors, while the lid is grounded to reduce noise interference, and the conductive portions are designed to reinforce the substrate and prevent unintentional short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring substrate includes only basic wiring conductors without additional conductive portions in the frame, then the device complexity is low, but the noise isolation and structural reinforcement are insufficient
Solution Approach 1:
The frame portion is segmented into multiple functional zones: a first conductive portion for noise isolation, a second conductive portion for structural reinforcement, and insulation portions. This segmentation allows each segment to perform its specific function optimally while contributing to the overall reliability of the wiring substrate.
Solution Approach 2:
Different regions of the frame portion are assigned different properties: the first conductive portion uses conductive material for noise isolation, the second conductive portion uses conductive material for reinforcement, and insulation portions use insulating material. This local differentiation of material properties enables targeted noise isolation and structural support without requiring the entire frame to be complex.
2Reliability
If the distance between the conductive portion and the inner side surface of the recess section is uniform, then the manufacturing precision is easier to control, but the noise isolation effectiveness is reduced
Solution Approach 1:
The distance between the first conductive portion and the inner side surface of the recess section varies at different locations. Specifically, the distance is greater at certain positions to enhance noise isolation effectiveness in those regions, while maintaining manufacturability by avoiding excessively complex geometries.
3Strength
If the frame portion is made entirely of insulating material, then the manufacturing simplicity is high, but the structural reinforcement and noise isolation are insufficient
Solution Approach 1:
The frame portion is divided into multiple segments with different material properties: conductive portions for reinforcement and noise isolation, and insulation portions for electrical isolation. This segmentation enables the structure to achieve both strength and ease of manufacture by using simple geometric forms with differentiated material assignments.
Solution Approach 2:
The frame portion employs a composite structure combining conductive and insulating materials in specific configurations. The first and second conductive portions provide structural reinforcement and noise isolation, while the insulation portions maintain electrical isolation, creating a composite material system that achieves multiple functions simultaneously.
Data Source
AI summary
To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.