Wiring Substrate Support Structure for Optical-Electrical Alignment

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Solution Overview

Problem

Existing wiring substrates face challenges in efficiently integrating optical and electrical components due to misalignment and thermal expansion issues, which affect optical coupling efficiency and stability.

Innovation Solution

A wiring substrate design that includes an insulating layer, conductor layer, and a support member spanning across both optical and electrical regions, allowing for precise alignment and thermal stability of optical and electrical components through a common support structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If separate support structures are used for optical and electrical components, then each component can be independently positioned, but misalignment occurs between optical and electrical regions

Engineering Contradiction:

Improvealignment precisionVSAvoidsupport structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines separate support structures for optical and electrical components into a single integrated support structure. This unified structure provides common reference surfaces and positioning features that ensure precise alignment between optical and electrical components while reducing overall structural complexity compared to multiple independent support systems.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The support structure is designed to serve multiple functions simultaneously: it provides mechanical support for both optical and electrical components, establishes precise alignment references for both component types, and maintains thermal stability across different regions. This multi-functional design eliminates the need for separate specialized support structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If rigid support structures are used to maintain alignment, then positional stability is improved, but thermal expansion effects increase

Engineering Contradiction:

Improvepositional stabilityVSAvoidthermal expansion

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The support structure utilizes materials and design parameters that accommodate thermal expansion while maintaining positional stability. By carefully selecting thermal expansion coefficients and designing expansion compensation mechanisms, the structure remains stable across temperature variations without requiring overly rigid constraints that would amplify thermal effects.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The integrated support structure acts as an intermediary that mediates between thermal expansion forces and component positioning requirements. It provides a compliant yet stable interface that absorbs thermal stresses while maintaining precise alignment, preventing direct transmission of expansion forces to the mounted components.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If a common support structure is used for optical and electrical components, then alignment is improved, but thermal management becomes more challenging

Engineering Contradiction:

Improvealignment precisionVSAvoidthermal management

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

While the support structure is integrated for alignment purposes, it incorporates segmented or zoned regions with different thermal management characteristics. These zones allow differential thermal expansion and provide pathways for heat dissipation from high-power electrical components while maintaining the overall structural integrity and alignment precision required for optical components.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260020147A1Wiring substrate

Publication Date: 2026.01.15 IBIDEN CO LTD

AI summary

A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.