Wiring Substrate Series-Parallel Pad Groups for Micro-Driver Power Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In micro light-emitting diode display technology, existing wiring substrates require high-power micro-driver chips to ensure proper operation of electronic components, leading to increased costs and complexity, as they need to provide output power proportional to the sum of resistances in function areas, which is inefficient and costly.
Innovation Solution
A wiring substrate design featuring a first pad group with an output pad, a constant voltage signal line, and a second pad group with sub-pad groups connected in series and parallel, where the constant voltage signal line is coupled to the sub-pad groups through a connection line, optimizing the series-parallel connection to reduce the output power required from the micro-driver chip, allowing for smaller, lower-cost micro-driver chips to be used.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-power micro-driver chips are used to ensure proper operation of electronic components, then the reliability of the display system is improved, but the device complexity and cost increase
Solution Approach 1:
The patent segments the pad group into multiple sub-pad groups connected in series-parallel configuration. Each sub-pad group contains multiple pad regions that can be independently connected to electronic components, allowing the current capacity to be distributed across multiple lower-power pathways rather than requiring a single high-power chip.
Solution Approach 2:
The patent changes the electrical parameters of the wiring substrate by creating multiple parallel current pathways through the series-parallel pad group configuration. This increases the overall current capacity and reduces the power requirement per chip, enabling the use of lower-power micro-driver chips while maintaining system reliability.
2Power
If high-power micro-driver chips are used to provide sufficient output power, then the electronic components can operate properly, but the cost increases
Solution Approach 1:
The pad group is divided into multiple sub-pad groups with multiple pad regions each, creating multiple parallel current pathways. This segmentation allows the total current requirement to be distributed across multiple lower-power channels, reducing the power rating (and cost) of individual micro-driver chips needed.
Solution Approach 2:
Multiple sub-pad groups are combined in a series-parallel configuration where pad regions within each sub-pad group are connected in series, and sub-pad groups are connected in parallel. This merging strategy creates equivalent resistance reduction, allowing multiple lower-power chips to collectively provide the necessary total power output at lower cost.
3Power
If series-parallel connection is optimized to reduce output power requirement, then smaller and less expensive micro-driver chips can be used, but the wiring substrate design complexity increases
Solution Approach 1:
The wiring substrate is segmented into multiple standardized sub-pad groups, each containing multiple pad regions. This modular segmentation simplifies the design process by providing a repeatable unit that can be configured in series-parallel arrangements, making the complex power distribution manageable through standardization.
Solution Approach 2:
The patent systematically changes the wiring substrate parameters by defining specific series-parallel connection configurations that transform the equivalent resistance and current capacity. By establishing standardized connection patterns, the design complexity is managed while achieving the desired power reduction effect.
4Power
If multiple sub-pad groups are connected in parallel with series connections within each group, then the equivalent resistance is reduced and current capacity is increased, but the wiring substrate area increases
Solution Approach 1:
The pad group is segmented into multiple compact sub-pad groups that can be arranged in space-efficient configurations. Each sub-pad group contains multiple pad regions connected in series, and the sub-pad groups are connected in parallel, creating a compact modular structure that increases current capacity while minimizing area expansion.
Data Source
AI summary
Provided are a wiring substrate and an electronic device, the wiring substrate includes a substrate; first pad group, arranged on the substrate, each of the first pad group including an output pad; a constant voltage signal line, arranged on a same side of the substrate as the first pad group; and second pad groups, including a plurality of sub-pad groups connected in parallel, each of the sub-pad groups including a plurality of pad regions connected in series.