Wiring Substrate Partitioned Bore Isolation
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Solution Overview
Problem
The existing wiring substrates face issues with electronic components moving during the filling of insulating resin, leading to potential short-circuiting due to pressure, as they are not effectively isolated within the bores of the core substrate.
Innovation Solution
The implementation of a core substrate with partitioned bores, where each electronic component is isolated by a partition formed from the core material, preventing direct contact and allowing the insulating resin to flow without causing components to shift and short-circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple electronic components are arranged in a bore of the core substrate, then the productivity and integration density are improved, but the electronic components may move and contact each other causing short-circuits
Solution Approach 1:
The patent divides a single large bore into multiple smaller bores within the core substrate. Each electronic component is accommodated in its own separate bore, which prevents the components from contacting each other even when insulating resin flows into the bores. This segmentation approach maintains high integration density while eliminating short-circuit risks between adjacent components.
2Reliability
If the bore is filled with insulating resin, then the electronic component is fixed and insulated, but the pressure of the resin may move the component in the planar direction
Solution Approach 1:
By dividing the bore into multiple smaller bores, the patent reduces the volume of insulating resin in each individual bore. This reduces the pressure exerted by the resin on each component during filling, thereby minimizing planar displacement of the components while still achieving effective fixation and insulation.
Solution Approach 2:
The patent introduces a cushioning layer between the electronic component and the insulating resin. This cushioning layer acts as an intermediary that absorbs the pressure from the resin during filling, preventing direct contact pressure that would cause component displacement while still allowing the resin to provide fixation and insulation.
3Ease of manufacture
If a temporary holding tape is used to close the bore, then the component can be arranged, but additional manufacturing steps are required
Solution Approach 1:
The patent divides the bore into multiple smaller bores, which allows the insulating resin to be filled directly into each small bore without requiring a temporary holding tape to seal a large bore. This eliminates the need for additional manufacturing steps involving tape attachment and removal, simplifying the overall manufacturing process while maintaining ease of component arrangement.
Data Source
AI summary
A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the core. The first wiring layer includes a first opening, and the second wiring layer includes a second opening. The core includes a plurality of electronic component accommodating bores that extend through the core at portions exposed from the first and second openings. An electronic component is arranged in each electronic component accommodating bore. The electronic component accommodating bores are filled with an insulating layer. The core includes a partition located between adjacent electronic component accommodating bores. The partition is formed by part of the core.