Wiring Substrate Plane Layout for Reduced Manufacturing Warping
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Solution Overview
Problem
Existing multi-layer wiring substrates face issues with warping and distortion during the manufacturing process due to the absence of balanced conductor layer configurations, particularly on the core substrate surfaces.
Innovation Solution
A wiring substrate design featuring a core substrate with conductor layers and insulating layers arranged to include land and plane parts on opposite surfaces, connected by through-hole and via conductors, ensuring balanced distribution and reduced warping through overlapping and connected plane parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor layers are added to increase wiring capacity, then signal transmission capability is improved, but warping and distortion during manufacturing worsen
Solution Approach 1:
The patent applies asymmetry by configuring different conductor layer arrangements on opposite surfaces of the core substrate. Specifically, the first conductor layer on the first surface includes a land part and plane part, while the second conductor layer on the second surface includes different patterns. This asymmetric configuration allows optimization of signal transmission on each surface while balancing the overall structure to prevent warping.
Solution Approach 2:
The patent implements local quality by creating different conductor layer configurations in different regions of the substrate. The land parts and plane parts are strategically positioned to provide specific functions (signal transmission, grounding, shielding) in different locations, allowing high-frequency signal transmission in critical areas while maintaining structural stability overall.
2Productivity
If multiple conductor layers are stacked to improve wiring density, then device functionality is enhanced, but manufacturing precision deteriorates due to alignment difficulties
Solution Approach 1:
The patent applies preliminary action by forming the core substrate with pre-configured conductor layers (first and second conductor layers with land and plane parts) before adding the insulating layers and subsequent conductor layers. This preliminary configuration establishes precise reference structures that guide subsequent layer formation, ensuring accurate alignment and reducing manufacturing complexity.
Data Source
AI summary
A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land and first plane parts, the second conductor layer includes second land and second plane parts, the third conductor layer includes fine wirings and a third plane part, the fourth conductor layer includes fine wirings and a fourth plane part, the substrate includes a through-hole conductor connecting the first and second land parts through the core insulating layer, a first via conductor connecting the first land part and third conductor layer, a second via conductor connecting the second land part and fourth conductor layer, a third via conductor connecting the first and third plane parts, and a fourth via conductor connecting the second and fourth plane parts.