Wiring Substrate Protruding Electrode Prevents Shorts
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Solution Overview
Problem
The existing wiring substrates face challenges in preventing shorts between external components and wirings due to their close proximity, which hinders the improvement of wiring density.
Innovation Solution
A wiring substrate design featuring a resin layer with embedded components and wirings, where electrodes protrude from the surface to create a spaced interval between external components and wirings, utilizing a specific structure with a wiring portion embedded in the resin and an electrode portion that protrudes higher than the wiring surface to prevent contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If external components are mounted on the wiring substrate with electrodes protruding from the resin layer, then component density is improved, but the risk of short between external components and wirings increases
Solution Approach 1:
The patent introduces a height dimension by making the electrode protrude from the resin layer surface to a position higher than the wiring exposed surface. This vertical separation in the third dimension (height) effectively prevents contact between external components mounted on electrodes and the wirings on the resin layer, while still allowing high-density component mounting.
Solution Approach 2:
The electrode acts as an intermediary element between external components and the internal wiring structure. By protruding above the wiring level, the electrode serves as a mediating connection point that electrically connects external components to internal wirings while physically isolating them from direct contact, thus preventing shorts.
2Productivity
If wiring density is increased by bringing wirings closer together, then productivity is improved, but the risk of short with external components increases
Solution Approach 1:
The patent resolves the conflict between high wiring density and short prevention by utilizing the vertical dimension. Wirings can be densely packed on the resin layer surface, while the electrode protrudes upward to create a height-based separation. This allows wirings to be close together horizontally without increasing short risk, as the electrode's elevated position maintains vertical clearance.
3Reliability
If electrode protrudes higher than wiring surface, then short prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The electrode is segmented into two functional portions: a wiring portion embedded in the resin layer for electrical connection, and an electrode portion protruding from the resin layer surface for external component mounting. This segmentation allows each portion to be optimized independently - the embedded portion integrates with internal wirings while the protruding portion provides elevated mounting capability.
Solution Approach 2:
The electrode structure serves multiple functions: it provides electrical connection to internal wirings, serves as a mounting substrate for external components, and acts as a physical barrier preventing shorts. This multi-functionality reduces the need for additional separate structures, thereby managing complexity while achieving short prevention.
Data Source
AI summary
A wiring substrate includes a resin layer formed of an insulating resin, a first component, at least a part of which is embedded in the resin layer, a first wiring embedded in the resin layer, the first wiring including an exposed surface exposed from the resin layer at a first surface-side of the resin layer, and a first electrode including a wiring portion and an electrode portion, the wiring portion embedded in the resin layer and connecting to the first component in the resin layer, the electrode portion protruding from the first surface-side of the resin layer to a position higher than the exposed surface of the first wiring.