Wiring Substrate Recess Formation for Embedded Conductor Control
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates face challenges in precisely controlling the depth of recesses in the second resin insulating layer, which affects the formation of conductor layers and can lead to issues like short circuits and poor signal transmission due to differences in filler content and particle size between the first and second resin insulating layers.
Innovation Solution
A method involving the formation of a second resin insulating layer with different laser processability than the first resin insulating layer, allowing for precise recess formation by laser irradiation that exposes the first resin insulating layer, enabling the embedding of a conductor layer with controlled thickness within the second resin insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is performed on the second resin insulating layer to form recesses, then conductor layers can be embedded with controlled thickness, but filler particles may be exposed or protrude into the recesses causing short circuits or signal interference
Solution Approach 1:
The patent applies local quality by creating a gradient in filler content across different insulating layers. The second resin insulating layer has lower filler content and smaller particle size specifically in the region where laser processing occurs, while the first resin insulating layer has higher filler content. This localized differentiation allows laser irradiation to form clean recesses without exposing problematic filler particles, resolving the contradiction between precision and harmful factors.
Solution Approach 2:
The patent changes physical parameters of the resin insulating layers, specifically controlling filler content and particle size. The second resin insulating layer is designed with lower filler content and smaller particle diameter compared to the first resin insulating layer. This parameter change enables the laser to penetrate and form recesses without encountering large filler particles that would protrude and cause electrical issues.
2Manufacturing precision
If the second resin insulating layer has lower filler content and smaller particle size for precise laser processing, then manufacturing precision improves, but the overall insulating layer structure becomes more complex
Solution Approach 1:
The patent segments the insulating layer structure into two distinct resin insulating layers with different properties. The first resin insulating layer contains higher filler content for structural stability, while the second resin insulating layer contains lower filler content and smaller particles for precise laser processing. This segmentation allows each layer to fulfill its specific function without compromising the other, achieving precision while managing complexity through functional differentiation.
3Strength
If conventional insulating layers with high filler content are used, then structural strength is maintained, but laser processing cannot precisely form recesses for thin conductor layers
Solution Approach 1:
The patent applies local quality by assigning different filler content levels to different layers based on their functional requirements. The first resin insulating layer maintains high filler content for structural strength, while the second resin insulating layer uses lower filler content for precise laser processing. This localized quality differentiation resolves the contradiction between strength and precision by optimizing each layer's composition for its specific purpose.
Solution Approach 2:
The patent uses composite materials with different filler compositions in different layers. The first resin insulating layer and second resin insulating layer are both composite materials but with different filler content and particle size distributions. This composite approach allows the structure to simultaneously achieve high strength (from the first layer) and precise laser processability (from the second layer).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of the conductor layer thickness and reduces the risk of short circuits and signal interference by optimizing filler content and particle size differences between the resin layers, enhancing the manufacturing process for wiring substrates.
Implementation Method 1
irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed
Data Source
AI summary
A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.